Intel_5SGSMD3E3H29I3WN
original

Intel
5SGSMD3E3H29I3WN

696-5SGSMD3E3H29I3WN
IC FPGA 360 I/O 780HBGA

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
13312000
Number of LABs/CLBs
89000
ECCN
OBSOLETE
Number of I/O
360
Mounting Type
Surface Mount
Product Status
Obsolete
Supplier Device Package
780-HBGA (33x33)
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5SGSMD3E3H29I3WN Description

It is easier to move this 5SGSMD3E3H29I3WN and keep it dry by using this "Tray" packaging technique. This electronic component is produced by a company. Its goal is to increase the supply of high-performance chips and better meet consumer demand. An IC is a collection of electronic components -- resistors, transistors, capacitors, etc. All stuff into a tiny chip, and connected together to achieve a common goal. This Intel's 5SGSMD3E3H29I3WN belongs to FPGAs category. And its FPGAs that falls under the category of Embedded IC Chips. This 5SGSMD3E3H29I3WN can function as an amplifier, oscillator, timer, counter, logic gate, computer memory, microcontroller or microprocessor. The cornerstone of all contemporary electronic gadgets is an integrated circuit (IC).

FAQ

What is the mounting type of 5SGSMD3E3H29I3WN?
5SGSMD3E3H29I3WN uses a Surface Mount mounting style based on the listed product specifications.
What operating temperature range does 5SGSMD3E3H29I3WN support?
What is 5SGSMD3E3H29I3WN?
What package or case is 5SGSMD3E3H29I3WN available in?
Are there related or alternative parts for 5SGSMD3E3H29I3WN?
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