Intel_5SGSMD4H2F35I3LN
original

Intel
5SGSMD4H2F35I3LN

696-5SGSMD4H2F35I3LN
PDF Datasheet
Field Programmable Gate Array, 360000-Cell, CMOS, PBGA1152, FBGA-1152

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Tech Specifications

Package/Case
FBGA
Data Rate
14.1Gbps
Lead Free
Lead Free
Max Operating Temperature
100°C
Memory Size
23.15Mb
Min Operating Temperature
-40°C
Number of GPIO
432
Number of I/Os
432
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5SGSMD4H2F35I3LN Description

Intel's 5SGSMD4H2F35I3LN is a high-performance, multi-standard wireless module that is designed to support a wide range of wireless communication standards and applications. This module is a part of Intel's FlexRAN product line, which is designed to provide a flexible and scalable solution for wireless communication infrastructure.

Description:

The 5SGSMD4H2F35I3LN is a small form factor module that is designed to be easily integrated into a variety of wireless communication systems. It is a multi-standard module that supports a wide range of wireless communication standards, including 5G NR, 4G LTE, 3G, and 2G. This makes it a versatile and flexible solution for a wide range of wireless communication applications.

Features:

Some of the key features of the 5SGSMD4H2F35I3LN include:

  1. Multi-standard support: The module supports a wide range of wireless communication standards, including 5G NR, 4G LTE, 3G, and 2G.
  2. High-performance: The module is designed to provide high-performance wireless communication capabilities, with support for high-speed data transfer and low latency.
  3. Small form factor: The module is compact and lightweight, making it easy to integrate into a variety of wireless communication systems.
  4. Scalability: The module is designed to be scalable, allowing it to support a wide range of wireless communication applications and use cases.
  5. Flexibility: The module is part of Intel's FlexRAN product line, which is designed to provide a flexible and scalable solution for wireless communication infrastructure.

Applications:

The 5SGSMD4H2F35I3LN is a versatile module that can be used in a wide range of wireless communication applications, including:

  1. Wireless communication infrastructure: The module can be used in wireless communication infrastructure, such as base stations and small cells, to provide high-performance wireless communication capabilities.
  2. Industrial IoT: The module can be used in industrial IoT applications, such as remote monitoring and control systems, to provide reliable and high-speed wireless communication.
  3. Automotive: The module can be used in automotive applications, such as connected cars and autonomous vehicles, to provide high-speed wireless communication capabilities.
  4. Smart cities: The module can be used in smart city applications, such as traffic management and public safety systems, to provide high-speed wireless communication capabilities.

Overall, the 5SGSMD4H2F35I3LN is a high-performance, multi-standard wireless module that is designed to support a wide range of wireless communication applications. Its small form factor, scalability, and flexibility make it a versatile and valuable solution for wireless communication infrastructure and other applications.

FAQ

What package or case is 5SGSMD4H2F35I3LN available in?
5SGSMD4H2F35I3LN is available in the FBGA package / case.
What voltage specification is listed for 5SGSMD4H2F35I3LN?
Are there related or alternative parts for 5SGSMD4H2F35I3LN?
What operating temperature range does 5SGSMD4H2F35I3LN support?
Is 5SGSMD4H2F35I3LN currently in stock?
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