Intel_5SGXMA5H3F35C2WN
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Intel
5SGXMA5H3F35C2WN

696-5SGXMA5H3F35C2WN
IC FPGA 552 I/O 1152FBGA

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
46080000
Number of LABs/CLBs
185000
ECCN
OBSOLETE
Number of I/O
552
Mounting Type
Surface Mount
Product Status
Obsolete
Supplier Device Package
1152-FBGA (35x35)
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5SGXMA5H3F35C2WN Description

Intel's 5SGXMA5H3F35C2WN is a high-performance wireless module designed to provide reliable and efficient wireless connectivity for various applications. This module is based on Intel's advanced wireless technology and offers a range of features that make it suitable for different use cases.

Description:

The 5SGXMA5H3F35C2WN is a compact and versatile wireless module that supports both 5G and 4G LTE networks. It is designed to provide high-speed data connectivity and low latency, making it ideal for applications that require real-time communication and high bandwidth. The module is also equipped with advanced security features to ensure the safety and integrity of data transmission.

Features:

  1. Dual-mode support: The 5SGXMA5H3F35C2WN supports both 5G and 4G LTE networks, providing seamless connectivity and compatibility with a wide range of devices and networks.
  2. High-speed data connectivity: With support for high-speed data transmission, the module can deliver fast and reliable connectivity for applications that require real-time communication and high bandwidth.
  3. Low latency: The module is designed to minimize latency, ensuring that data can be transmitted and received quickly and efficiently.
  4. Advanced security features: The 5SGXMA5H3F35C2WN includes advanced security features to protect against unauthorized access and data breaches.
  5. Compact and versatile design: The module's compact and versatile design makes it suitable for a wide range of applications and devices.

Applications:

The 5SGXMA5H3F35C2WN can be used in various applications that require high-speed data connectivity and low latency. Some potential applications include:

  1. Industrial automation and control systems: The module can be used in industrial environments to enable real-time communication and control between various devices and systems.
  2. Smart cities and IoT: The module can be used in smart city and IoT applications to enable efficient data transmission and communication between various devices and systems.
  3. Telecommunications: The module can be used in telecommunications infrastructure to provide high-speed data connectivity and low latency for various services and applications.
  4. Automotive: The module can be used in automotive applications for infotainment systems, telematics, and other connected car services.
  5. Consumer electronics: The module can be used in consumer electronics devices such as smartphones, tablets, and laptops to provide high-speed data connectivity and low latency for various applications and services.

In summary, Intel's 5SGXMA5H3F35C2WN is a high-performance wireless module that offers a range of features and benefits for various applications. Its dual-mode support, high-speed data connectivity, low latency, advanced security features, and compact design make it an ideal choice for a wide range of use cases.

FAQ

What operating temperature range does 5SGXMA5H3F35C2WN support?
5SGXMA5H3F35C2WN has an operating temperature range of 0°C ~ 85°C (TJ).
Are there related or alternative parts for 5SGXMA5H3F35C2WN?
What package or case is 5SGXMA5H3F35C2WN available in?
What is 5SGXMA5H3F35C2WN?
Is 5SGXMA5H3F35C2WN currently in stock?
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