Intel_5SGXMB6R3F43I4G
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Intel
5SGXMB6R3F43I4G

696-5SGXMB6R3F43I4G
IC FPGA 600 I/O 1760FBGA
26 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
53248000
Number of LABs/CLBs
225400
Number of I/O
600
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
1760-FCBGA (42.5x42.5)
Series
Stratix® V GX
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5SGXMB6R3F43I4G Description

Intel's 5SGXMB6R3F43I4G is a high-performance memory module designed for use in servers and workstations. This memory module is part of Intel's Scalable Memory Buffer (SMB) family, which offers high-speed, low-latency memory solutions for demanding applications.

Description:

The 5SGXMB6R3F43I4G is a DDR4 memory module with a capacity of 64GB. It operates at a speed of 3200MHz and has a CAS latency of 24. This memory module features Intel's advanced error-correcting code (ECC) technology, which helps to ensure data integrity and reliability in critical applications.

Features:

  1. High-capacity DDR4 memory: With a capacity of 64GB, the 5SGXMB6R3F43I4G provides ample memory for demanding applications.
  2. High-speed operation: The memory module operates at a speed of 3200MHz, ensuring fast data transfer rates and improved system performance.
  3. Low-latency design: With a CAS latency of 24, the 5SGXMB6R3F43I4G offers low-latency memory access, which is crucial for real-time applications.
  4. Advanced ECC technology: The memory module features Intel's advanced ECC technology, which helps to detect and correct data corruption, ensuring reliable operation in critical applications.
  5. Scalable Memory Buffer (SMB) support: As part of Intel's SMB family, the 5SGXMB6R3F43I4G offers high-speed, low-latency memory solutions for servers and workstations.

Applications:

The Intel 5SGXMB6R3F43I4G memory module is designed for use in servers and workstations that require high-performance memory solutions. Some potential applications include:

  1. Data centers: The high-speed, low-latency memory provided by the 5SGXMB6R3F43I4G is ideal for data center environments, where fast and reliable memory access is critical for optimal performance.
  2. High-performance computing (HPC): The memory module's advanced ECC technology and high capacity make it suitable for HPC applications, where data integrity and system reliability are essential.
  3. Virtualization and cloud computing: The 5SGXMB6R3F43I4G can help improve the performance and reliability of virtualized environments and cloud computing platforms.
  4. Enterprise applications: The memory module's high capacity and performance make it suitable for enterprise applications that require large amounts of memory and fast data access.
  5. Scientific and research applications: The 5SGXMB6R3F43I4G's advanced ECC technology and high-speed operation make it ideal for scientific and research applications that demand high levels of data integrity and performance.

FAQ

What is the mounting type of 5SGXMB6R3F43I4G?
5SGXMB6R3F43I4G uses a Surface Mount mounting style based on the listed product specifications.
What voltage specification is listed for 5SGXMB6R3F43I4G?
What is 5SGXMB6R3F43I4G?
What operating temperature range does 5SGXMB6R3F43I4G support?
What package or case is 5SGXMB6R3F43I4G available in?
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