Intel_AGFA006R16A3I3V
Intel_AGFA006R16A3I3V
original

Intel
AGFA006R16A3I3V

777-AGFA006R16A3I3V
IC FPGA AGILEX-F 2340FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
384
Peripherals
DMA, WDT
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AGFA006R16A3I3V Description

AGFA006R16A3I3V Description

The AGFA006R16A3I3V is a high-performance FPGA (Field-Programmable Gate Array) from Intel's Agilex F series, designed for embedded systems and complex digital designs. This IC (Integrated Circuit) chip is built on advanced architecture, combining a Micro-Processing Unit (MPU) with FPGA capabilities, offering a versatile platform for a wide range of applications. The AGFA006R16A3I3V operates at a speed of 1.4GHz, ensuring rapid processing and efficient execution of tasks. It features 256KB of RAM, providing ample memory for data storage and manipulation. With 384 I/O pins, this FPGA offers extensive connectivity options, making it suitable for intricate and multi-functional designs. The chip also includes essential peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer), enhancing its functionality and reliability.

AGFA006R16A3I3V Features

  • High-Speed Performance: The AGFA006R16A3I3V operates at a speed of 1.4GHz, ensuring rapid processing capabilities. This high-speed performance is ideal for applications requiring real-time data processing and quick response times.
  • Advanced Architecture: Combining MPU and FPGA functionalities, this chip offers a versatile platform for both processing and programmable logic tasks. This dual-architecture allows for efficient handling of complex tasks and provides flexibility in design.
  • Robust Memory and I/O: With 256KB of RAM and 384 I/O pins, the AGFA006R16A3I3V can handle large data sets and support multiple input/output operations. This makes it suitable for applications requiring extensive connectivity and data handling.
  • Comprehensive Peripherals: The inclusion of DMA and WDT peripherals enhances the chip's functionality. DMA allows for efficient data transfer, while the WDT ensures system reliability by monitoring and resetting the system if necessary.
  • Extensive Connectivity Options: The AGFA006R16A3I3V supports a variety of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This wide range of connectivity options makes it suitable for a variety of applications and ensures seamless integration with other components.
  • Active Product Status: The AGFA006R16A3I3V is currently in an active product status, ensuring availability and support for ongoing projects and future developments.
  • Moisture Sensitivity Level (MSL) 3: The chip is rated at MSL 3 (168 hours), indicating its suitability for environments with varying humidity levels, ensuring reliability and longevity in diverse conditions.

AGFA006R16A3I3V Applications

The AGFA006R16A3I3V is ideal for a variety of applications, particularly those requiring high-speed processing, extensive connectivity, and robust memory. Some specific use cases include:

  • Embedded Systems: The AGFA006R16A3I3V is well-suited for embedded systems where real-time processing and efficient data handling are crucial. Its high-speed performance and extensive I/O capabilities make it ideal for applications such as industrial automation, automotive systems, and IoT (Internet of Things) devices.
  • Communication Systems: The extensive connectivity options, including Ethernet and USB OTG, make the AGFA006R16A3I3V suitable for communication systems. It can be used in network devices, routers, and other communication infrastructure where reliable and efficient data transfer is essential.
  • Consumer Electronics: The AGFA006R16A3I3V can be used in consumer electronics such as smart TVs, gaming consoles, and advanced multimedia devices. Its high-speed processing and extensive I/O capabilities ensure smooth operation and enhanced user experience.
  • Medical Devices: The AGFA006R16A3I3V's reliability and extensive connectivity options make it suitable for medical devices such as diagnostic equipment, monitoring systems, and medical imaging devices. Its ability to handle large data sets and ensure real-time processing is crucial in these applications.

Conclusion of AGFA006R16A3I3V

The AGFA006R16A3I3V from Intel's Agilex F series is a versatile and high-performance FPGA designed for a wide range of applications. Its combination of MPU and FPGA functionalities, along with its extensive memory, I/O capabilities, and comprehensive peripherals, make it an ideal choice for embedded systems, communication systems, consumer electronics, and medical devices. The chip's high-speed performance, extensive connectivity options, and robust memory ensure efficient data handling and reliable operation. With an active product status and a moisture sensitivity level of 3, the AGFA006R16A3I3V is a reliable and future-proof solution for complex digital designs.

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