Intel_AGFA008R24C2I3V
Intel_AGFA008R24C2I3V
original

Intel
AGFA008R24C2I3V

777-AGFA008R24C2I3V
IC FPGA AGILEX-F 2340FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
576
Peripherals
DMA, WDT
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AGFA008R24C2I3V Description

AGFA008R24C2I3V Description

The AGFA008R24C2I3V is an advanced embedded IC chip from Intel's Agilex F series, designed to meet the demanding requirements of modern embedded systems. This IC features a powerful 1.4GHz processing speed, combining the capabilities of a Micro-Processing Unit (MPU) and Field-Programmable Gate Array (FPGA) architecture. With 256KB of RAM and 576 I/O ports, it offers robust performance and extensive connectivity options. The AGFA008R24C2I3V also includes essential peripherals like DMA (Direct Memory Access) and WDT (Watchdog Timer), ensuring efficient data handling and system reliability.

Packaged in a 2340FBGA format, this IC is designed for high-density applications and comes in a tray package with a Moisture Sensitivity Level (MSL) of 3, allowing for 168 hours of exposure before assembly. This makes it suitable for a wide range of industrial and commercial applications where reliability and durability are paramount.

AGFA008R24C2I3V Features

  • High-Speed Processing: The 1.4GHz speed ensures rapid execution of complex tasks, making it ideal for real-time processing and high-performance computing.
  • Dual Architecture: Combining MPU and FPGA capabilities, this IC offers the flexibility to handle both general-purpose computing and custom logic functions.
  • Robust Memory and I/O: With 256KB of RAM and 576 I/O ports, the AGFA008R24C2I3V can manage large datasets and interface with numerous external devices.
  • Advanced Connectivity: The chip supports a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration into various systems.
  • Peripheral Integration: Integrated DMA and WDT peripherals enhance data transfer efficiency and system stability.
  • Reliability: The MSL 3 rating ensures the IC can withstand environmental conditions during manufacturing and assembly processes.

AGFA008R24C2I3V Applications

The AGFA008R24C2I3V is well-suited for a variety of applications due to its versatile architecture and extensive feature set. Some ideal use cases include:

  • Industrial Automation: The high I/O count and robust connectivity options make it perfect for controlling complex machinery and systems in industrial environments.
  • Telecommunications: The combination of MPU and FPGA capabilities allows for efficient signal processing and data handling in telecom infrastructure.
  • Embedded Systems: Its compact form factor and high performance make it ideal for embedded systems in consumer electronics, automotive, and IoT devices.
  • Medical Devices: The AGFA008R24C2I3V can be used in medical imaging and diagnostic equipment, where real-time processing and reliability are critical.

Conclusion of AGFA008R24C2I3V

The AGFA008R24C2I3V from Intel's Agilex F series stands out as a versatile and powerful embedded IC chip. Its unique combination of MPU and FPGA architecture, coupled with extensive connectivity options and robust peripherals, makes it a standout choice for a wide range of applications. Whether used in industrial automation, telecommunications, or embedded systems, the AGFA008R24C2I3V offers superior performance, reliability, and flexibility. Its active product status ensures ongoing support and development, making it a reliable choice for engineers and designers in the electronics industry.

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AGFA008R24C2I3V is a System On Chip (SoC) from Intel. This product page provides its main specifications, pricing information, availability, and inquiry options.
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