Intel_AGFA012R24B3E3E
Intel_AGFA012R24B3E3E
original

Intel
AGFA012R24B3E3E

777-AGFA012R24B3E3E
IC FPGA AGILEX-F 2486FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
768
Peripherals
DMA, WDT
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AGFA012R24B3E3E Description

AGFA012R24B3E3E Description

The AGFA012R24B3E3E is a high-performance Embedded IC Chip from Intel's Agilex F series, designed to meet the demanding requirements of modern embedded systems. This IC integrates a powerful 1.4GHz processor with a versatile architecture that includes both a Micro-Processing Unit (MPU) and a Field-Programmable Gate Array (FPGA). The chip is equipped with 256KB of RAM, providing ample memory for complex operations and data processing. It supports a wide operating temperature range of 0°C to 100°C (TJ), making it suitable for various environmental conditions.

AGFA012R24B3E3E Features

  • High-Speed Processing: The AGFA012R24B3E3E features a 1.4GHz processor, ensuring rapid execution of tasks and efficient handling of data-intensive applications.
  • Robust Architecture: The combination of MPU and FPGA architecture allows for both general-purpose processing and highly customizable hardware acceleration, providing flexibility and adaptability.
  • Extensive I/O Capabilities: With 768 I/O pins, this IC can interface with a wide array of external devices, facilitating complex system designs.
  • Rich Peripheral Set: Integrated peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer) enhance system performance and reliability.
  • Advanced Connectivity Options: The AGFA012R24B3E3E supports multiple connectivity protocols including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, enabling seamless integration into diverse systems.
  • Moisture Sensitivity Level (MSL) 3: The chip is rated for 168 hours of exposure, ensuring reliability in various manufacturing and operational environments.
  • Active Product Status: This ensures that the AGFA012R24B3E3E is a current and supported solution, with ongoing development and customer support.

AGFA012R24B3E3E Applications

The AGFA012R24B3E3E is ideal for a range of applications where high performance, flexibility, and robust connectivity are required. Key use cases include:

  • Industrial Automation: The chip's extensive I/O capabilities and wide operating temperature range make it suitable for controlling complex industrial processes and machinery.
  • Telecommunications: The advanced connectivity options and high-speed processing enable efficient data handling and communication in networking equipment.
  • Automotive Electronics: The robust architecture and extensive peripherals support the development of advanced driver-assistance systems (ADAS) and in-vehicle infotainment systems.
  • Medical Devices: The AGFA012R24B3E3E can be used in medical imaging and diagnostic equipment, where reliable and high-speed data processing is critical.
  • Consumer Electronics: The chip's versatility and connectivity options make it a strong candidate for smart home devices, gaming consoles, and other consumer electronics requiring high performance and adaptability.

Conclusion of AGFA012R24B3E3E

The AGFA012R24B3E3E from Intel's Agilex F series is a versatile and powerful Embedded IC Chip, offering a unique blend of high-speed processing, extensive I/O capabilities, and advanced connectivity options. Its robust architecture and wide operating temperature range make it suitable for a variety of demanding applications across multiple industries. The inclusion of essential peripherals and its active product status further enhance its value, making it a reliable and future-proof solution for embedded system designers.

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What is AGFA012R24B3E3E?
AGFA012R24B3E3E is a System On Chip (SoC) from Intel. This product page provides its main specifications, pricing information, availability, and inquiry options.
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