Intel_AGFA012R24C2E3V
Intel_AGFA012R24C2E3V
original

Intel
AGFA012R24C2E3V

777-AGFA012R24C2E3V
IC FPGA AGILEX-F 2340FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
744
Peripherals
DMA, WDT
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AGFA012R24C2E3V Description

AGFA012R24C2E3V Description

The AGFA012R24C2E3V is a high-performance System on Chip (SoC) developed by Intel, belonging to the Agilex F series. This SoC is designed to deliver exceptional processing capabilities and flexibility, making it ideal for a wide range of applications. It features a 1.4GHz processing speed, ensuring rapid data handling and execution of complex tasks. The operating temperature range of 0°C to 100°C (TJ) makes it suitable for both standard and rugged environments.

AGFA012R24C2E3V Features

  • Architecture: The AGFA012R24C2E3V combines a Microprocessor Unit (MPU) with Field Programmable Gate Array (FPGA) technology, offering a versatile platform for both general-purpose processing and customizable hardware acceleration.
  • RAM Size: Equipped with 256KB of RAM, this SoC provides ample memory for efficient data storage and retrieval, supporting complex operations and multitasking.
  • I/O Capabilities: With 744 I/O pins, the AGFA012R24C2E3V offers extensive connectivity options, enabling seamless integration with various peripherals and systems.
  • Peripherals: The SoC includes essential peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer), enhancing its functionality and reliability.
  • Connectivity: The AGFA012R24C2E3V supports a wide array of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly adaptable for different application requirements.
  • Package: The SoC is packaged in a Tray format with a Moisture Sensitivity Level (MSL) of 3 (168 Hours), ensuring robustness and reliability during storage and handling.

AGFA012R24C2E3V Applications

The AGFA012R24C2E3V is well-suited for applications that require high performance, flexibility, and robust connectivity. Some specific use cases include:

  • Industrial Automation: The combination of MPU and FPGA allows for real-time control and data processing, making it ideal for industrial automation systems.
  • Telecommunications: The extensive connectivity options and high processing speed make it suitable for telecommunications infrastructure, such as base stations and network routers.
  • Embedded Systems: The AGFA012R24C2E3V can be used in embedded systems where compact size, high performance, and low power consumption are critical.
  • Internet of Things (IoT): The SoC's ability to handle multiple I/O and connectivity options makes it a strong candidate for IoT devices, enabling seamless communication and data processing.

Conclusion of AGFA012R24C2E3V

The AGFA012R24C2E3V is a powerful and versatile SoC that stands out in its category due to its unique combination of MPU and FPGA architecture, extensive I/O capabilities, and robust connectivity options. Its high processing speed and ample RAM ensure efficient performance, while its wide operating temperature range and moisture sensitivity level make it suitable for various environments. Whether used in industrial automation, telecommunications, embedded systems, or IoT applications, the AGFA012R24C2E3V offers significant advantages over similar models, making it a reliable choice for engineers and designers in the electronics industry.

FAQ

What operating temperature range does AGFA012R24C2E3V support?
AGFA012R24C2E3V has an operating temperature range of 0°C ~ 100°C (TJ).
What is AGFA012R24C2E3V?
Is AGFA012R24C2E3V currently in stock?
What package or case is AGFA012R24C2E3V available in?
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