Intel_AGFA012R24C3E3E
Intel_AGFA012R24C3E3E
original

Intel
AGFA012R24C3E3E

777-AGFA012R24C3E3E
IC FPGA AGILEX-F 2340FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
744
Peripherals
DMA, WDT
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AGFA012R24C3E3E Description

AGFA012R24C3E3E Description

The AGFA012R24C3E3E is an advanced Embedded IC Chip from Intel's Agilex F series, designed to deliver exceptional performance and versatility for a wide range of applications. This IC features a 1.4GHz processing speed and operates within a temperature range of 0°C to 100°C (TJ), making it suitable for both standard and rugged environments. The architecture combines a Microprocessor Unit (MPU) with Field Programmable Gate Array (FPGA) capabilities, providing flexibility and programmability for complex tasks.

AGFA012R24C3E3E Features

  • High Performance: The AGFA012R24C3E3E boasts a 1.4GHz processing speed, ensuring rapid execution of tasks and efficient handling of data-intensive operations.
  • Robust Architecture: The combination of MPU and FPGA architecture offers a balance between fixed-function processing and reconfigurable logic, ideal for applications requiring both high performance and adaptability.
  • Substantial RAM: Equipped with 256KB of RAM, this IC can handle significant data storage and processing tasks, enhancing its capability for complex applications.
  • Extensive I/O Connectivity: With 744 I/O pins, the AGFA012R24C3E3E provides ample connectivity options, supporting a wide array of peripherals and interfaces.
  • Rich Peripheral Set: Features such as DMA (Direct Memory Access) and WDT (Watchdog Timer) enhance functionality and reliability, making the IC suitable for embedded systems that require robust error handling and efficient data transfer.
  • Versatile Connectivity Options: The AGFA012R24C3E3E supports multiple connectivity protocols including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration into various systems.
  • Packaging and Reliability: Packaged in a Tray format with a Moisture Sensitivity Level (MSL) of 3 (168 Hours), the IC is designed for reliable handling and storage, reducing the risk of damage during manufacturing processes.
  • Active Product Status: As an active product, the AGFA012R24C3E3E benefits from ongoing support and updates from Intel, ensuring long-term viability and compatibility with evolving technologies.

AGFA012R24C3E3E Applications

The AGFA012R24C3E3E is ideal for a variety of applications due to its high performance, extensive connectivity, and robust architecture. Key applications include:

  • Industrial Automation: The IC's high processing speed and extensive I/O capabilities make it suitable for controlling complex machinery and systems in industrial environments.
  • Embedded Systems: Its MPU and FPGA architecture, combined with rich peripheral support, make it ideal for developing embedded systems that require both fixed-function processing and reconfigurable logic.
  • Networking Equipment: The support for multiple connectivity protocols, including Ethernet and USB OTG, makes it a strong candidate for networking applications such as routers, switches, and network interface cards.
  • Consumer Electronics: The AGFA012R24C3E3E's ability to handle significant data storage and processing tasks makes it suitable for consumer electronics that require high performance and reliability.
  • Automotive Systems: The operating temperature range and robust architecture make it suitable for automotive applications where reliability and performance are critical.

Conclusion of AGFA012R24C3E3E

The AGFA012R24C3E3E from Intel's Agilex F series is a versatile and high-performance Embedded IC Chip, offering a unique blend of MPU and FPGA capabilities. Its extensive I/O connectivity, substantial RAM, and rich peripheral set make it suitable for a wide range of applications, from industrial automation to consumer electronics. The IC's robust architecture and active product status ensure long-term reliability and support, making it an excellent choice for developers and engineers looking for a reliable and adaptable solution.

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