Intel_AGFA014R24B2I3V
Intel_AGFA014R24B2I3V
original

Intel
AGFA014R24B2I3V

777-AGFA014R24B2I3V
IC FPGA AGILEX-F 2486FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
768
Peripherals
DMA, WDT
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AGFA014R24B2I3V Description

AGFA014R24B2I3V Description

The AGFA014R24B2I3V is an advanced System on Chip (SoC) from Intel's Agilex F series, designed to deliver high performance and flexibility in a compact form factor. This IC FPGA features a 1.4GHz processing speed, leveraging a dual-architecture approach combining a Microprocessor Unit (MPU) with Field Programmable Gate Array (FPGA) capabilities. It offers 256KB of RAM, ensuring efficient data handling and processing. With 768 I/O ports, the AGFA014R24B2I3V provides extensive connectivity options, making it suitable for a wide range of applications. The SoC also includes essential peripherals such as Direct Memory Access (DMA) and Watchdog Timer (WDT), enhancing its functionality and reliability. The product is currently active, indicating its availability and suitability for new designs.

AGFA014R24B2I3V Features

The AGFA014R24B2I3V stands out due to its unique combination of features and performance capabilities:

  • High-Speed Processing: The 1.4GHz speed ensures rapid data processing, making it ideal for applications requiring real-time data handling.
  • Dual Architecture: The MPU and FPGA architecture allows for both general-purpose processing and customizable logic, providing a versatile solution for complex systems.
  • Robust Memory and I/O: With 256KB of RAM and 768 I/O ports, this SoC can handle large datasets and interface with numerous peripherals, enhancing its application scope.
  • Enhanced Connectivity: The AGFA014R24B2I3V supports a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it suitable for diverse networking and communication tasks.
  • Reliability and Durability: Packaged in a Tray format with a Moisture Sensitivity Level (MSL) of 3 (168 Hours), the AGFA014R24B2I3V is designed to withstand various environmental conditions, ensuring long-term reliability.

AGFA014R24B2I3V Applications

The AGFA014R24B2I3V is well-suited for a variety of applications due to its high performance and extensive connectivity options:

  • Industrial Automation: The robust I/O capabilities and high-speed processing make it ideal for controlling complex industrial processes and machinery.
  • Embedded Systems: Its compact size and versatile architecture are perfect for developing compact, high-performance embedded systems.
  • Networking and Communication: The extensive connectivity options, including Ethernet and USB OTG, make it suitable for networking devices and communication systems.
  • Consumer Electronics: The AGFA014R24B2I3V can be used in advanced consumer electronics where high processing power and flexibility are required.
  • Automotive Systems: The reliability and durability make it a good fit for automotive applications, where it can handle critical tasks such as engine control and infotainment systems.

Conclusion of AGFA014R24B2I3V

The AGFA014R24B2I3V is a powerful and versatile SoC that offers a unique blend of high-speed processing, flexible architecture, and extensive connectivity options. Its robust features and reliability make it an excellent choice for a wide range of applications, from industrial automation to consumer electronics. The combination of MPU and FPGA capabilities provides a significant advantage over similar models, allowing for both general-purpose processing and customizable logic. With its active product status and extensive technical specifications, the AGFA014R24B2I3V is poised to meet the demands of modern electronic systems, ensuring long-term performance and adaptability.

FAQ

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