Intel_AGFA014R24C2I1VB
Intel_AGFA014R24C2I1VB
original

Intel
AGFA014R24C2I1VB

777-AGFA014R24C2I1VB
IC FPGA AGILEX-F 2340BGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
744
Peripherals
DMA, WDT
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AGFA014R24C2I1VB Description

AGFA014R24C2I1VB Description

The AGFA014R24C2I1VB is an advanced Embedded IC Chip belonging to the Agilex F series, manufactured by Intel. This IC FPGA is designed to deliver exceptional performance and versatility, making it ideal for a wide range of embedded applications. The AGFA014R24C2I1VB features a 1.4GHz processing speed, powered by a combination of MPU and FPGA architecture. It boasts 256KB of RAM, ensuring efficient data handling and processing capabilities. With 744 I/Os, this chip offers extensive connectivity options, supporting EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The inclusion of DMA and WDT peripherals further enhances its functionality. The AGFA014R24C2I1VB is packaged in a 2340BGA format and is available in a tray package, making it suitable for automated assembly processes.

AGFA014R24C2I1VB Features

  • High-Speed Processing: The AGFA014R24C2I1VB operates at a speed of 1.4GHz, providing rapid data processing capabilities that are essential for demanding applications.
  • Dual Architecture: The combination of MPU and FPGA architecture allows for both high-level processing and customizable logic functions, offering flexibility and adaptability.
  • Robust RAM: With 256KB of RAM, this IC can handle substantial data loads efficiently, ensuring smooth operation even in complex environments.
  • Extensive I/O Connectivity: The 744 I/Os support multiple connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly versatile.
  • Advanced Peripherals: The inclusion of DMA and WDT peripherals enhances the chip's functionality, providing efficient data management and reliable operation.
  • Active Product Status: The AGFA014R24C2I1VB is an active product, ensuring continued support and availability for ongoing projects.
  • Tray Packaging: The tray package format facilitates easy handling and integration into automated assembly lines, reducing production time and costs.

AGFA014R24C2I1VB Applications

The AGFA014R24C2I1VB is well-suited for a variety of applications due to its high performance and extensive connectivity options. Some ideal use cases include:

  • Industrial Automation: The high-speed processing and extensive I/O capabilities make it ideal for controlling complex machinery and systems in industrial environments.
  • Telecommunications: The support for Ethernet and USB OTG connectivity enables the development of advanced communication devices and infrastructure.
  • Embedded Systems: The combination of MPU and FPGA architecture allows for the creation of highly customized embedded systems with specific functionalities.
  • Automotive Electronics: The robustness and versatility of the AGFA014R24C2I1VB make it suitable for automotive applications, such as advanced driver assistance systems (ADAS) and in-vehicle infotainment (IVI) systems.
  • Medical Devices: The high reliability and extensive connectivity options are crucial for developing medical devices that require precise control and data handling.

Conclusion of AGFA014R24C2I1VB

The AGFA014R24C2I1VB is a powerful and versatile Embedded IC Chip that stands out in the Agilex F series. Its 1.4GHz processing speed, dual MPU and FPGA architecture, and 256KB of RAM make it capable of handling complex tasks efficiently. The extensive I/O connectivity options and advanced peripherals further enhance its functionality, making it suitable for a wide range of applications. Whether used in industrial automation, telecommunications, embedded systems, automotive electronics, or medical devices, the AGFA014R24C2I1VB offers a reliable and high-performance solution. Its active product status and tray packaging ensure continued support and ease of integration into modern production processes.

FAQ

What package or case is AGFA014R24C2I1VB available in?
AGFA014R24C2I1VB is available in the 2340-BFBGA Exposed Pad package / case.
What operating temperature range does AGFA014R24C2I1VB support?
Is AGFA014R24C2I1VB currently in stock?
Are there related or alternative parts for AGFA014R24C2I1VB?
What is AGFA014R24C2I1VB?
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