Intel_AGFA019R25A2E3E
Intel_AGFA019R25A2E3E
original

Intel
AGFA019R25A2E3E

777-AGFA019R25A2E3E
IC FPGA AGILEX-F 2581FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFA019R25A2E3E Description

AGFA019R25A2E3E Description

The AGFA019R25A2E3E is an advanced Embedded IC Chip from Intel's Agilex F series, designed to deliver high performance and flexibility for a wide range of applications. This IC features a 1.4GHz operating speed, ensuring rapid processing capabilities. It is built with a robust architecture that includes a Microprocessor Unit (MPU) and Field-Programmable Gate Array (FPGA), providing versatile programmability and processing power. The device operates within a temperature range of 0°C to 100°C (TJ), making it suitable for various environmental conditions. With 256KB of RAM, it offers sufficient memory for complex tasks. The AGFA019R25A2E3E also includes 480 I/O ports, enhancing its connectivity options. Additional peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer) further enhance its functionality. The product is currently active in the market, ensuring availability and support.

AGFA019R25A2E3E Features

  • High-Speed Performance: The 1.4GHz speed ensures that the AGFA019R25A2E3E can handle demanding computational tasks with ease, making it ideal for applications requiring real-time processing.
  • Wide Operating Temperature Range: With an operating temperature range of 0°C to 100°C (TJ), this IC is suitable for deployment in environments with varying temperatures, from cold industrial settings to high-heat applications.
  • Versatile Architecture: The combination of MPU and FPGA architecture provides both high-level processing capabilities and the flexibility to customize hardware logic, offering a unique blend of performance and adaptability.
  • Substantial RAM: 256KB of RAM allows for efficient handling of data-intensive tasks, ensuring smooth operation even with multiple processes running concurrently.
  • Extensive I/O Connectivity: 480 I/O ports provide ample connectivity options, enabling integration with a wide array of peripheral devices and systems.
  • Advanced Peripherals: Features such as DMA and WDT enhance the device's functionality, improving data transfer efficiency and system reliability.
  • Active Product Status: As an active product, the AGFA019R25A2E3E benefits from ongoing support and updates from Intel, ensuring long-term viability and compatibility.
  • Moisture Sensitivity Level (MSL) 3: The MSL 3 rating (168 hours) ensures that the device can withstand typical manufacturing processes without degradation, maintaining its reliability and performance.

AGFA019R25A2E3E Applications

The AGFA019R25A2E3E is well-suited for a variety of applications due to its high performance and flexibility. Some specific use cases include:

  • Industrial Automation: The robust architecture and wide temperature range make it ideal for controlling complex machinery and processes in industrial environments.
  • Telecommunications: The high-speed processing and extensive connectivity options are perfect for managing data traffic and signal processing in telecom infrastructure.
  • Embedded Systems: The combination of MPU and FPGA allows for the development of highly customized embedded solutions, suitable for a range of consumer and industrial devices.
  • Automotive Electronics: The device's reliability and performance make it suitable for automotive applications, such as advanced driver-assistance systems (ADAS) and in-vehicle infotainment systems.
  • Medical Devices: The AGFA019R25A2E3E can be used in medical equipment where high reliability and real-time processing are critical, such as diagnostic tools and monitoring devices.

Conclusion of AGFA019R25A2E3E

The AGFA019R25A2E3E from Intel's Agilex F series is a powerful and versatile Embedded IC Chip that stands out in its category. Its high-speed processing capabilities, extensive connectivity options, and robust architecture make it a top choice for demanding applications across various industries. The wide operating temperature range and moisture sensitivity level ensure its reliability in diverse environments. With ongoing support from Intel, the AGFA019R25A2E3E is poised to remain a key component in advanced electronic systems for years to come.

FAQ

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