Intel_AGFA019R31C2I2V
Intel_AGFA019R31C2I2V
original

Intel
AGFA019R31C2I2V

777-AGFA019R31C2I2V
PDF Datasheet
IC FPGA AGILEX-F 3184FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFA019R31C2I2V Description

AGFA019R31C2I2V Description

The AGFA019R31C2I2V is an advanced Embedded IC Chip from Intel's Agilex F series, designed to deliver high performance and flexibility in a compact form factor. This IC features a powerful 1.4GHz processing speed, leveraging a dual-architecture of MPU and FPGA to handle complex computational tasks efficiently. With 256KB of RAM and 480 I/O capabilities, it offers robust memory and connectivity options. The AGFA019R31C2I2V is equipped with essential peripherals such as DMA and WDT, ensuring reliable operation. Its connectivity options include EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it versatile for a wide range of applications. The product is currently active and is packaged in a tray format, ideal for industrial and embedded systems.

AGFA019R31C2I2V Features

  • High-Speed Processing: The AGFA019R31C2I2V operates at a speed of 1.4GHz, providing rapid data processing capabilities suitable for real-time applications.
  • Dual Architecture: Combining MPU and FPGA, this IC offers the flexibility to handle both general-purpose processing and specialized, high-speed tasks.
  • Robust Memory and I/O: With 256KB of RAM and 480 I/O ports, it supports extensive data storage and communication needs.
  • Comprehensive Connectivity: The AGFA019R31C2I2V integrates multiple connectivity options, including Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration into various systems.
  • Essential Peripherals: Equipped with DMA and WDT, it ensures efficient data management and reliable operation.
  • Active Product Status: As an active product, it benefits from ongoing support and updates from Intel, ensuring long-term viability.
  • Tray Packaging: The tray packaging format is ideal for industrial applications, ensuring durability and ease of integration.

AGFA019R31C2I2V Applications

The AGFA019R31C2I2V is ideal for a variety of applications requiring high performance and flexibility. Its dual architecture and extensive connectivity options make it suitable for:

  • Industrial Automation: Managing complex control systems and data processing tasks in manufacturing environments.
  • Embedded Systems: Providing robust processing power for embedded devices in IoT, automotive, and medical applications.
  • Networking: Handling high-speed data transmission and processing in networking equipment.
  • Telecommunications: Supporting advanced communication protocols and data management in telecommunication infrastructure.
  • Consumer Electronics: Enhancing performance in smart devices and consumer electronics requiring efficient data processing and connectivity.

Conclusion of AGFA019R31C2I2V

The AGFA019R31C2I2V is a versatile and powerful Embedded IC Chip from Intel's Agilex F series, offering high-speed processing, dual architecture, and extensive connectivity options. Its robust memory and I/O capabilities, combined with essential peripherals, make it an ideal choice for a wide range of applications, from industrial automation to consumer electronics. The active product status ensures ongoing support and updates, making it a reliable choice for long-term projects. With its tray packaging format, the AGFA019R31C2I2V is well-suited for industrial environments, ensuring durability and ease of integration.

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