Intel_AGFA022R24C2E3V
Intel_AGFA022R24C2E3V
original

Intel
AGFA022R24C2E3V

777-AGFA022R24C2E3V
IC FPGA AGILEX-F 2340FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
744
Peripherals
DMA, WDT
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AGFA022R24C2E3V Description

AGFA022R24C2E3V Description

The AGFA022R24C2E3V is an advanced embedded IC chip from Intel's Agilex F series, designed to deliver high performance and flexibility in a compact form factor. This IC features a 1.4GHz processing speed, ensuring rapid data handling and efficient execution of complex tasks. The operating temperature range of 0°C to 100°C (TJ) makes it suitable for a wide variety of industrial and commercial applications, where environmental conditions can vary significantly.

The architecture of the AGFA022R24C2E3V combines a powerful MPU with an FPGA, providing a versatile platform for both general-purpose processing and specialized, programmable logic tasks. With 256KB of RAM, the chip can handle substantial amounts of data, making it ideal for applications requiring high-speed data processing and storage. The 744 I/O pins offer extensive connectivity options, allowing for seamless integration with a wide range of peripheral devices and systems.

AGFA022R24C2E3V Features

  • High-Speed Processing: The 1.4GHz speed ensures that the AGFA022R24C2E3V can handle demanding computational tasks with ease, making it suitable for real-time processing and high-frequency data handling.
  • Wide Operating Temperature Range: The ability to operate between 0°C and 100°C (TJ) makes this IC ideal for applications in harsh environments, such as industrial automation and automotive systems.
  • Versatile Architecture: The combination of MPU and FPGA architecture provides a balance between general-purpose processing and customizable logic, allowing for efficient execution of both standard and specialized tasks.
  • Robust Connectivity: The AGFA022R24C2E3V supports a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration with various peripheral devices.
  • Peripheral Support: Integrated peripherals such as DMA and WDT enhance the functionality and reliability of the chip, making it suitable for applications requiring robust data management and system monitoring.
  • Active Product Status: As an active product, the AGFA022R24C2E3V benefits from ongoing support and updates, ensuring long-term reliability and compatibility with evolving industry standards.
  • Moisture Sensitivity Level (MSL) 3: The MSL 3 rating (168 hours) ensures that the chip is protected against moisture damage during manufacturing and storage, reducing the risk of defects and failures.

AGFA022R24C2E3V Applications

The AGFA022R24C2E3V is ideal for a variety of applications where high performance, flexibility, and robustness are critical. Some specific use cases include:

  • Industrial Automation: The wide operating temperature range and extensive connectivity options make this IC suitable for controlling and monitoring industrial processes, where reliability and real-time data processing are essential.
  • Automotive Systems: The ability to operate in high-temperature environments and the robust connectivity options make it ideal for automotive applications, such as engine control units and advanced driver assistance systems (ADAS).
  • Telecommunications: The high-speed processing and extensive I/O capabilities support the development of advanced communication systems, including base stations and network routers.
  • Medical Devices: The AGFA022R24C2E3V can be used in medical equipment, such as diagnostic imaging systems and patient monitoring devices, where high reliability and data processing speed are crucial.
  • Consumer Electronics: The versatile architecture and extensive connectivity options make this IC suitable for a wide range of consumer electronics, including smart home devices, gaming consoles, and high-performance computing systems.

Conclusion of AGFA022R24C2E3V

The AGFA022R24C2E3V from Intel's Agilex F series is a highly versatile and powerful embedded IC chip, offering a unique combination of high-speed processing, robust connectivity, and extensive I/O capabilities. Its wide operating temperature range and moisture sensitivity level make it suitable for a variety of demanding applications, from industrial automation to automotive systems. The integration of MPU and FPGA architecture provides a balance between general-purpose processing and customizable logic, ensuring that the chip can handle both standard and specialized tasks with ease. With its active product status and ongoing support, the AGFA022R24C2E3V is an excellent choice for engineers and designers looking for a reliable and high-performance solution for their next project.

FAQ

What operating temperature range does AGFA022R24C2E3V support?
AGFA022R24C2E3V has an operating temperature range of 0°C ~ 100°C (TJ).
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