Intel_AGFA022R24C2I3E
Intel_AGFA022R24C2I3E
original

Intel
AGFA022R24C2I3E

777-AGFA022R24C2I3E
IC FPGA AGILEX-F 2340FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
744
Peripherals
DMA, WDT
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AGFA022R24C2I3E Description

AGFA022R24C2I3E Description

The AGFA022R24C2I3E is an advanced embedded IC chip from Intel's Agilex F series, designed to deliver high performance and flexibility in a compact form factor. This IC is ideal for applications requiring robust processing capabilities and extensive connectivity options. The AGFA022R24C2I3E features a 1.4GHz processing speed, powered by a combination of MPU and FPGA architecture, ensuring efficient and versatile operation. It includes 256KB of RAM, providing ample memory for complex tasks and data handling. With a total of 744 I/Os, this chip offers extensive connectivity and control capabilities, making it suitable for a wide range of embedded systems.

AGFA022R24C2I3E Features

  • High-Speed Processing: The AGFA022R24C2I3E operates at a speed of 1.4GHz, ensuring rapid processing of data and instructions.
  • Advanced Architecture: It combines MPU and FPGA architecture, offering both high performance and programmability.
  • Robust Memory: Equipped with 256KB of RAM, this IC can handle complex tasks and large datasets efficiently.
  • Extensive I/O Capabilities: With 744 I/Os, the AGFA022R24C2I3E provides ample connectivity options for various peripherals and systems.
  • Peripheral Support: Includes DMA (Direct Memory Access) and WDT (Watchdog Timer) for enhanced system management and reliability.
  • Active Product Status: This ensures that the AGFA022R24C2I3E is currently in production and supported by Intel.
  • Connectivity Options: Features EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly versatile for different communication protocols.
  • Packaging and Sensitivity: The chip is packaged in a Tray format with a Moisture Sensitivity Level (MSL) of 3 (168 Hours), ensuring durability and reliability during storage and handling.

AGFA022R24C2I3E Applications

The AGFA022R24C2I3E is well-suited for a variety of applications due to its high performance, extensive connectivity, and robust architecture. Some ideal use cases include:

  • Industrial Automation: The combination of high processing speed and extensive I/O capabilities makes it ideal for controlling complex machinery and systems in industrial environments.
  • Networking Equipment: The inclusion of Ethernet and USB OTG connectivity options allows it to be used in networking devices, such as routers and switches, where high-speed data processing and communication are crucial.
  • Embedded Systems: Its compact form factor and versatile architecture make it suitable for embedded systems in consumer electronics, automotive, and IoT applications.
  • Medical Devices: The AGFA022R24C2I3E can be used in medical equipment where reliable processing and data handling are essential for patient monitoring and diagnostic systems.

Conclusion of AGFA022R24C2I3E

The AGFA022R24C2I3E from Intel's Agilex F series is a powerful and versatile embedded IC chip that offers a combination of high processing speed, extensive connectivity, and robust architecture. Its 1.4GHz speed and MPU/FPGA architecture ensure efficient and flexible operation, making it suitable for a wide range of applications. The inclusion of 256KB of RAM and 744 I/Os further enhances its capabilities, allowing it to handle complex tasks and integrate with various peripherals. With its extensive connectivity options and active product status, the AGFA022R24C2I3E stands out as a reliable and high-performance solution for modern embedded systems.

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