Intel_AGFA022R24C2I3V
Intel_AGFA022R24C2I3V
original

Intel
AGFA022R24C2I3V

777-AGFA022R24C2I3V
IC FPGA AGILEX-F 2340FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
744
Peripherals
DMA, WDT
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AGFA022R24C2I3V Description

AGFA022R24C2I3V Description

The AGFA022R24C2I3V is an advanced Embedded IC Chip belonging to Intel's Agilex F series, designed to deliver high performance and flexibility for a variety of applications. This IC features a powerful 1.4GHz processing speed, combining a Micro-Processing Unit (MPU) and Field-Programmable Gate Array (FPGA) architecture to provide versatile computing capabilities. With 256KB of RAM, it ensures efficient data handling and processing. The chip boasts 744 I/O ports, offering extensive connectivity options. Additionally, it includes essential peripherals such as Direct Memory Access (DMA) and Watchdog Timer (WDT) to enhance system reliability and performance. The AGFA022R24C2I3V is packaged in a 2340FBGA format and is available in tray packaging, with a Moisture Sensitivity Level (MSL) of 3, ensuring 168 hours of protection against moisture damage. This product is currently active in the market, ready for integration into various embedded systems.

AGFA022R24C2I3V Features

  • High-Speed Processing: The AGFA022R24C2I3V operates at a speed of 1.4GHz, ensuring rapid execution of complex tasks and algorithms.
  • Dual Architecture: Combining MPU and FPGA, this chip offers both high-performance processing and programmable logic capabilities, making it suitable for diverse applications.
  • Robust Memory and I/O: With 256KB of RAM and 744 I/O ports, it provides ample memory and extensive connectivity options, supporting large-scale data processing and interfacing with multiple peripherals.
  • Advanced Peripherals: Integrated DMA and WDT enhance system performance and reliability by managing data transfers efficiently and monitoring system operations to prevent crashes.
  • Comprehensive Connectivity: The AGFA022R24C2I3V supports a wide range of communication protocols, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration with various external devices.
  • Reliable Packaging: The 2340FBGA package format and MSL 3 rating ensure the chip's durability and protection against environmental factors, making it suitable for industrial and rugged environments.

AGFA022R24C2I3V Applications

The AGFA022R24C2I3V is ideal for applications requiring high computational power and flexible programmability. Its dual architecture makes it suitable for:

  • Industrial Automation: Managing complex control systems and real-time data processing in manufacturing plants.
  • Telecommunications: Implementing high-speed signal processing and communication protocols in networking equipment.
  • Automotive Systems: Enhancing vehicle control units and advanced driver-assistance systems (ADAS) with reliable and efficient processing.
  • Medical Devices: Supporting medical imaging and diagnostic equipment with precise data handling and processing capabilities.
  • Consumer Electronics: Enabling advanced features in smart devices, such as high-resolution video processing and AI-driven functionalities.

Conclusion of AGFA022R24C2I3V

The AGFA022R24C2I3V stands out as a versatile and high-performance Embedded IC Chip, offering a unique combination of MPU and FPGA capabilities. Its robust memory, extensive connectivity options, and advanced peripherals make it a reliable choice for a wide range of applications. With its active product status and comprehensive feature set, the AGFA022R24C2I3V is well-suited to meet the demands of modern embedded systems, providing significant advantages over similar models in terms of performance, flexibility, and reliability.

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