Intel_AGFA023R24C2I1V
Intel_AGFA023R24C2I1V
original

Intel
AGFA023R24C2I1V

777-AGFA023R24C2I1V
IC
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFA023R24C2I1V Description

AGFA023R24C2I1V Description

The AGFA023R24C2I1V is a high-performance System on Chip (SoC) from Intel's Agilex F series, designed to deliver exceptional processing capabilities and versatile connectivity options. This SoC is powered by a 1.4GHz processor, combining a Microprocessor Unit (MPU) and Field-Programmable Gate Array (FPGA) architecture. It features 256KB of RAM and supports 480 I/O channels, making it highly adaptable for a wide range of applications. The AGFA023R24C2I1V also includes essential peripherals such as Direct Memory Access (DMA) and Watchdog Timer (WDT), ensuring robust and reliable operation. The product is currently active and available in a tray package, offering convenient handling and integration.

AGFA023R24C2I1V Features

  • High-Speed Processing: The 1.4GHz processor ensures rapid execution of complex tasks, making the AGFA023R24C2I1V suitable for demanding applications requiring high computational power.
  • Versatile Architecture: The combination of MPU and FPGA architecture provides a balance between programmability and performance, allowing for both general-purpose processing and custom hardware acceleration.
  • Substantial RAM: With 256KB of RAM, the SoC can handle multiple tasks simultaneously without compromising on performance, making it ideal for multitasking environments.
  • Extensive I/O Connectivity: The AGFA023R24C2I1V supports 480 I/O channels, providing ample interfaces for connecting various peripherals and systems.
  • Advanced Peripherals: Integrated DMA and WDT peripherals enhance system efficiency and reliability, ensuring smooth data transfer and system monitoring.
  • Rich Connectivity Options: The SoC offers a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration with other devices and networks.
  • Active Product Status: As an active product, the AGFA023R24C2I1V benefits from ongoing support and updates from Intel, ensuring long-term reliability and compatibility.
  • Tray Packaging: The tray package format simplifies handling and integration into various electronic systems, making it convenient for both prototyping and mass production.

AGFA023R24C2I1V Applications

The AGFA023R24C2I1V is well-suited for a variety of applications due to its powerful processing capabilities and extensive connectivity options. Some specific use cases include:

  • Industrial Automation: The combination of high-speed processing and robust connectivity makes it ideal for controlling complex machinery and systems in industrial environments.
  • Embedded Systems: Its versatile architecture and extensive I/O options make it suitable for developing advanced embedded systems, such as smart sensors and IoT devices.
  • Networking Equipment: The SoC's Ethernet and USB OTG connectivity options make it a strong candidate for networking applications, including routers and switches.
  • Consumer Electronics: The AGFA023R24C2I1V can be used in consumer electronics for tasks such as data processing and control, enhancing the functionality and performance of devices like smart home appliances and wearable technology.
  • Automotive Systems: Its reliability and extensive connectivity options make it suitable for automotive applications, such as advanced driver-assistance systems (ADAS) and in-vehicle infotainment systems.

Conclusion of AGFA023R24C2I1V

The AGFA023R24C2I1V stands out as a versatile and powerful System on Chip (SoC) from Intel's Agilex F series. Its unique combination of high-speed processing, versatile architecture, substantial RAM, and extensive connectivity options make it a standout choice for a wide range of applications. Whether used in industrial automation, embedded systems, networking equipment, consumer electronics, or automotive systems, the AGFA023R24C2I1V offers significant advantages over similar models. Its active product status and convenient tray packaging further enhance its appeal, making it a reliable and efficient choice for modern electronic systems.

FAQ

What package or case is AGFA023R24C2I1V available in?
AGFA023R24C2I1V is available in the 2340-BFBGA Exposed Pad package / case.
Is AGFA023R24C2I1V currently in stock?
Are there related or alternative parts for AGFA023R24C2I1V?
What is the standard lead time for AGFA023R24C2I1V?
What operating temperature range does AGFA023R24C2I1V support?
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