Intel
AGFA023R24C2I3E

777-AGFA023R24C2I3E
IC FPGA AGILEX-F 2340BGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFA023R24C2I3E Description

AGFA023R24C2I3E Description

The AGFA023R24C2I3E is a high-performance System On Chip (SoC) from Intel's Agilex F series, designed to meet the demanding requirements of modern electronics applications. This IC FPGA features a 1.4GHz processing speed, ensuring rapid data handling and efficient operation. The architecture combines a Microprocessor Unit (MPU) with Field-Programmable Gate Array (FPGA) capabilities, offering unparalleled flexibility and adaptability for a wide range of tasks.

With 256KB of RAM, the AGFA023R24C2I3E provides sufficient memory to handle complex operations and data storage needs. The chip is equipped with 480 I/O ports, enabling extensive connectivity options and compatibility with various peripheral devices. Additionally, it includes essential peripherals such as Direct Memory Access (DMA) and Watchdog Timer (WDT) to enhance system performance and reliability.

The AGFA023R24C2I3E is housed in a 2340 BGA package, which is ideal for compact and high-density designs. The product is currently in an active status, ensuring continued support and availability for ongoing projects and future developments.

AGFA023R24C2I3E Features

The AGFA023R24C2I3E boasts several unique features that set it apart from similar models in the market:

  • High-Speed Processing: The 1.4GHz speed ensures that the SoC can handle high-frequency operations, making it suitable for applications requiring real-time processing and rapid data throughput.
  • Flexible Architecture: The combination of MPU and FPGA architecture provides a versatile platform that can be programmed and reconfigured to meet specific application needs.
  • Robust Connectivity: The SoC supports a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration with various external devices and networks.
  • Enhanced Memory and I/O: With 256KB of RAM and 480 I/O ports, the AGFA023R24C2I3E can manage large datasets and complex operations, making it ideal for applications requiring extensive data handling.
  • Peripheral Integration: The inclusion of DMA and WDT peripherals enhances system performance and reliability, ensuring efficient data transfer and system monitoring.
  • Compact Packaging: The 2340 BGA package is designed for high-density applications, making it suitable for compact and space-constrained designs.

AGFA023R24C2I3E Applications

The AGFA023R24C2I3E is ideal for a variety of applications across different industries, including:

  • Embedded Systems: The SoC's high-speed processing and extensive connectivity options make it suitable for embedded systems requiring real-time data processing and communication.
  • Industrial Automation: The robust architecture and I/O capabilities enable the AGFA023R24C2I3E to be used in industrial automation applications, where reliability and adaptability are crucial.
  • Telecommunications: The SoC's Ethernet and USB OTG connectivity options make it ideal for telecommunications applications, where high-speed data transfer and network integration are essential.
  • Consumer Electronics: The compact packaging and versatile connectivity options make the AGFA023R24C2I3E suitable for consumer electronics, where space constraints and compatibility with various peripherals are important considerations.

Conclusion of AGFA023R24C2I3E

The AGFA023R24C2I3E from Intel's Agilex F series is a powerful and versatile SoC that offers a combination of high-speed processing, flexible architecture, and robust connectivity options. Its unique features and advantages make it an ideal choice for a wide range of applications, from embedded systems to industrial automation and telecommunications. The compact 2340 BGA package ensures compatibility with space-constrained designs, while the extensive I/O and peripheral support enhance system performance and reliability. The AGFA023R24C2I3E is a reliable and efficient solution for modern electronics applications, providing developers with a robust platform to build innovative and high-performance systems.

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