Intel_AGFA023R25A1E1V
Intel_AGFA023R25A1E1V
original

Intel
AGFA023R25A1E1V

777-AGFA023R25A1E1V
IC FPGA AGILEX-F 2581FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFA023R25A1E1V Description

AGFA023R25A1E1V Description

The AGFA023R25A1E1V is a high-performance embedded IC chip from Intel's Agilex F series, designed to meet the demanding requirements of modern embedded systems. This IC features a 1.4GHz processing speed and operates within a temperature range of 0°C to 100°C (TJ), making it suitable for a wide range of industrial and commercial applications. The architecture combines a Micro-Processing Unit (MPU) with a Field-Programmable Gate Array (FPGA), offering flexibility and high computational power. The chip includes 256KB of RAM and supports 480 I/Os, providing ample memory and connectivity options. Additional peripherals such as Direct Memory Access (DMA) and Watchdog Timer (WDT) enhance its functionality. The AGFA023R25A1E1V is currently in active production, ensuring availability for ongoing projects.

AGFA023R25A1E1V Features

The AGFA023R25A1E1V stands out due to its advanced features and performance capabilities:

  • High-Speed Processing: With a clock speed of 1.4GHz, this IC ensures rapid data processing, making it ideal for applications requiring real-time data handling.
  • Wide Operating Temperature Range: The ability to operate between 0°C and 100°C (TJ) makes it suitable for both harsh industrial environments and standard commercial settings.
  • Flexible Architecture: The combination of MPU and FPGA allows for both high-level processing and customizable logic, providing a versatile solution for various applications.
  • Robust Memory and I/O: 256KB of RAM and 480 I/Os offer ample resources for complex tasks and extensive connectivity.
  • Enhanced Peripherals: Features like DMA and WDT improve system reliability and efficiency.
  • Rich Connectivity Options: The chip supports a variety of interfaces including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration with other components.
  • Packaging and Reliability: The AGFA023R25A1E1V is packaged in a tray and has a Moisture Sensitivity Level (MSL) of 3 (168 Hours), ensuring durability and protection during handling and storage.

AGFA023R25A1E1V Applications

The AGFA023R25A1E1V is well-suited for a variety of applications due to its robust features and performance:

  • Industrial Automation: Its wide operating temperature range and high I/O count make it ideal for controlling complex machinery and systems in industrial settings.
  • Embedded Systems: The combination of MPU and FPGA allows for the development of sophisticated embedded systems with both high-level processing and customizable logic.
  • Networking and Communication: The extensive connectivity options, including Ethernet and USB OTG, make it suitable for networking devices and communication systems.
  • Consumer Electronics: The AGFA023R25A1E1V can be used in high-performance consumer electronics where real-time processing and reliable operation are critical.
  • Automotive Electronics: Its robustness and wide temperature range make it a good fit for automotive applications, where reliability and performance are paramount.

Conclusion of AGFA023R25A1E1V

The AGFA023R25A1E1V from Intel's Agilex F series is a versatile and powerful embedded IC chip that offers a comprehensive set of features and performance capabilities. Its high-speed processing, wide operating temperature range, and flexible architecture make it an excellent choice for a variety of applications, from industrial automation to consumer electronics. The extensive connectivity options and robust peripherals further enhance its functionality, making it a reliable and efficient solution for modern embedded systems. With its active product status and reliable packaging, the AGFA023R25A1E1V is poised to meet the needs of engineers and designers looking for a high-performance, versatile IC for their projects.

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