Intel_AGFA023R31C3I3E
Intel_AGFA023R31C3I3E
original

Intel
AGFA023R31C3I3E

777-AGFA023R31C3I3E
PDF Datasheet
IC FPGA AGILEX-F 3184FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFA023R31C3I3E Description

AGFA023R31C3I3E Description

The AGFA023R31C3I3E is a high-performance System on Chip (SoC) from Intel's Agilex F series, designed to deliver exceptional processing capabilities and versatile connectivity options. This SoC is equipped with a 1.4GHz processor and features a robust architecture combining a Micro Processing Unit (MPU) and Field-Programmable Gate Array (FPGA). It offers a substantial 256KB of RAM, providing ample memory for complex operations and data processing. With 480 I/O ports, the AGFA023R31C3I3E ensures extensive connectivity and flexibility in system design.

AGFA023R31C3I3E Features

The AGFA023R31C3I3E stands out with its comprehensive set of peripherals, including Direct Memory Access (DMA) and Watchdog Timer (WDT), which enhance system efficiency and reliability. Its connectivity options are extensive, supporting Enhanced Burst Interface (EBI), Enhanced Memory Interface (EMI), Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This rich connectivity profile makes it suitable for a wide range of applications requiring high-speed data transfer and robust communication protocols.

The product is currently in an active status, ensuring that it meets the latest industry standards and is supported by Intel. The AGFA023R31C3I3E is packaged in a 3184FBGA format, which is ideal for high-density applications and provides excellent thermal performance. This packaging method also ensures compatibility with modern PCB designs and manufacturing processes.

AGFA023R31C3I3E Applications

The AGFA023R31C3I3E is particularly well-suited for applications that demand high computational power and extensive connectivity. It is ideal for use in advanced industrial automation systems, where real-time data processing and control are critical. Its robust architecture and high-speed connectivity make it a perfect fit for IoT gateways, enabling seamless communication between various devices and the cloud.

In the telecommunications sector, the AGFA023R31C3I3E can be used in base stations and network infrastructure equipment, providing the necessary processing power and connectivity for high-speed data transmission. Additionally, its versatility makes it suitable for embedded systems in automotive and aerospace industries, where reliability and performance are paramount.

Conclusion of AGFA023R31C3I3E

The AGFA023R31C3I3E from Intel's Agilex F series is a powerful and versatile SoC that offers significant advantages over similar models. Its combination of a 1.4GHz MPU and FPGA architecture, coupled with 256KB of RAM and 480 I/O ports, ensures high performance and flexibility. The extensive connectivity options and robust peripherals make it suitable for a wide range of applications, from industrial automation to telecommunications and embedded systems.

With its active product status and advanced packaging, the AGFA023R31C3I3E is well-positioned to meet the evolving needs of modern electronics. Its unique features and performance benefits make it a standout choice for engineers and designers looking to integrate a reliable and high-performance SoC into their projects.

FAQ

What operating temperature range does AGFA023R31C3I3E support?
AGFA023R31C3I3E has an operating temperature range of -40°C ~ 100°C (TJ).
Is AGFA023R31C3I3E currently in stock?
Are there related or alternative parts for AGFA023R31C3I3E?
What package or case is AGFA023R31C3I3E available in?
What is the standard lead time for AGFA023R31C3I3E?
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