Intel_AGFA027R24C3I3V
Intel_AGFA027R24C3I3V
original

Intel
AGFA027R24C3I3V

777-AGFA027R24C3I3V
IC FPGA AGILEX-F 2340FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
744
Peripherals
DMA, WDT
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AGFA027R24C3I3V Description

AGFA027R24C3I3V Description

The AGFA027R24C3I3V is an advanced Embedded IC Chip from Intel's Agilex F series, designed to deliver high performance and flexibility for a wide range of applications. This IC features a powerful 1.4GHz processing speed, combining a MPU (Micro-Processing Unit) and FPGA (Field-Programmable Gate Array) architecture to provide both programmability and high computational capabilities. The device is equipped with 256KB of RAM, ensuring efficient data handling and storage. It supports a substantial number of I/O connections (744), making it highly versatile for complex systems. Additional peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer) enhance its functionality and reliability. The AGFA027R24C3I3V is currently in an active product status, indicating its availability and support from Intel.

AGFA027R24C3I3V Features

The AGFA027R24C3I3V stands out with its robust connectivity options, including EBI/EMI (External Bus Interface/External Memory Interface), Ethernet, I2C (Inter-Integrated Circuit), MMC/SD/SDIO (MultiMediaCard/Secure Digital/Secure Digital Input Output), SPI (Serial Peripheral Interface), UART/USART (Universal Asynchronous Receiver/Transmitter/Universal Synchronous/Asynchronous Receiver/Transmitter), and USB OTG (On-The-Go). These connectivity features make it ideal for integration into diverse electronic systems, facilitating seamless communication and data transfer.

Packaged in a 2340FBGA (Fine Ball Grid Array) format, the AGFA027R24C3I3V ensures high-density and reliable mounting on printed circuit boards. Its Moisture Sensitivity Level (MSL) of 3 (168 Hours) indicates that it can withstand moderate levels of moisture exposure, making it suitable for various environmental conditions.

AGFA027R24C3I3V Applications

The AGFA027R24C3I3V is particularly well-suited for applications requiring high computational power and extensive connectivity. Its combination of MPU and FPGA architecture allows for both high-speed processing and customizable logic, making it ideal for embedded systems, industrial control, and IoT (Internet of Things) applications. The extensive I/O capabilities and diverse connectivity options enable it to serve as a central processing unit in complex systems, such as smart grids, automotive electronics, and advanced robotics.

Conclusion of AGFA027R24C3I3V

The AGFA027R24C3I3V from Intel's Agilex F series is a versatile and powerful Embedded IC Chip that offers a unique blend of processing power, programmability, and connectivity. Its 1.4GHz speed, MPU and FPGA architecture, and 256KB RAM make it a strong contender for applications requiring high performance and flexibility. The extensive connectivity options and robust I/O capabilities further enhance its suitability for a wide range of electronic systems. With its active product status and reliable packaging, the AGFA027R24C3I3V is a reliable choice for engineers and designers looking to integrate advanced processing capabilities into their projects.

FAQ

What operating temperature range does AGFA027R24C3I3V support?
AGFA027R24C3I3V has an operating temperature range of -40°C ~ 100°C (TJ).
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