Intel_AGFA027R25A2I3E
Intel_AGFA027R25A2I3E
original

Intel
AGFA027R25A2I3E

777-AGFA027R25A2I3E
IC FPGA AGILEX-F 2581FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
624
Peripherals
DMA, WDT
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AGFA027R25A2I3E Description

AGFA027R25A2I3E Description

The AGFA027R25A2I3E is an advanced Embedded IC Chip from Intel's Agilex F series, designed for high-performance applications requiring robust processing capabilities and extensive connectivity options. This IC features a 1.4GHz processing speed, powered by a combination of MPU and FPGA architecture, ensuring efficient and versatile performance across a wide range of applications. With 256KB of RAM and 624 I/O ports, the AGFA027R25A2I3E offers substantial memory and connectivity, making it ideal for complex embedded systems.

AGFA027R25A2I3E Features

  • High-Speed Processing: The AGFA027R25A2I3E operates at a speed of 1.4GHz, providing rapid data processing capabilities essential for real-time applications.
  • Dual Architecture: Combining MPU and FPGA architecture, this IC offers both high-speed processing and programmable flexibility, making it suitable for a variety of tasks.
  • Substantial Memory and I/O: Equipped with 256KB of RAM and 624 I/O ports, the AGFA027R25A2I3E can handle large datasets and multiple peripheral connections.
  • Advanced Peripherals: Features Direct Memory Access (DMA) and Watchdog Timer (WDT) for enhanced system control and reliability.
  • Extensive Connectivity: Supports a wide range of interfaces including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration into various systems.
  • Active Product Status: The AGFA027R25A2I3E is currently active, ensuring availability and support for ongoing projects.
  • Moisture Sensitivity Level: MSL 3 (168 Hours) ensures the IC can be stored and handled under standard conditions without degradation.
  • Packaging: Available in a tray package, suitable for efficient handling and integration into manufacturing processes.

AGFA027R25A2I3E Applications

The AGFA027R25A2I3E is ideal for a variety of high-performance embedded applications, including:

  • Industrial Automation: Its robust architecture and extensive connectivity make it suitable for controlling complex machinery and systems.
  • Telecommunications: The high-speed processing and versatile connectivity options are perfect for managing data in communication networks.
  • Automotive Systems: The AGFA027R25A2I3E can be used in advanced driver-assistance systems (ADAS) and infotainment systems, providing reliable and efficient performance.
  • Medical Devices: Its high reliability and extensive I/O capabilities make it suitable for medical imaging and diagnostic equipment.
  • Consumer Electronics: The AGFA027R25A2I3E can enhance the performance of smart home devices, gaming consoles, and other consumer electronics requiring high-speed processing and connectivity.

Conclusion of AGFA027R25A2I3E

The AGFA027R25A2I3E from Intel's Agilex F series stands out as a powerful and versatile Embedded IC Chip. Its combination of high-speed processing, dual architecture, substantial memory, and extensive connectivity options make it a superior choice for a wide range of applications. Whether used in industrial automation, telecommunications, automotive systems, medical devices, or consumer electronics, the AGFA027R25A2I3E delivers reliable performance and advanced capabilities. Its active product status and suitable moisture sensitivity level further ensure its reliability and availability for ongoing projects.

FAQ

What is AGFA027R25A2I3E?
AGFA027R25A2I3E is a System On Chip (SoC) from Intel. This product page provides its main specifications, pricing information, availability, and inquiry options.
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