Intel_AGFB006R16A2I1V
Intel_AGFB006R16A2I1V
original

Intel
AGFB006R16A2I1V

777-AGFB006R16A2I1V
IC FPGA AGILEX-F 1546FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
384
Peripherals
DMA, WDT
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AGFB006R16A2I1V Description

AGFB006R16A2I1V Description

The AGFB006R16A2I1V is a high-performance System on Chip (SoC) from Intel's Agilex F series, designed to meet the demanding requirements of modern embedded systems. This IC FPGA features a robust architecture combining a 1.4GHz MPU with an FPGA, offering a versatile platform for a wide range of applications. With 256KB of RAM and 384 I/O ports, the AGFB006R16A2I1V provides ample memory and connectivity options. It supports multiple peripherals, including DMA and WDT, enhancing its functionality and reliability. The product is currently active and is packaged in a 1546FBGA format, with a moisture sensitivity level (MSL) of 3, ensuring 168 hours of protection.

AGFB006R16A2I1V Features

High-Speed Processing: The AGFB006R16A2I1V boasts a 1.4GHz MPU, delivering rapid processing capabilities ideal for time-sensitive applications. This speed ensures efficient handling of complex tasks, making it suitable for high-performance computing environments.

Versatile Architecture: Combining an MPU with an FPGA, this SoC offers a flexible architecture that can be tailored to specific needs. The FPGA allows for custom logic implementation, while the MPU handles general-purpose processing, providing a balanced solution for diverse applications.

Robust Memory and I/O: With 256KB of RAM and 384 I/O ports, the AGFB006R16A2I1V provides ample memory and connectivity options. This makes it suitable for applications requiring extensive data handling and communication with multiple peripherals.

Comprehensive Connectivity: The AGFB006R16A2I1V supports a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This extensive connectivity suite ensures seamless integration with various external devices and networks.

Enhanced Functionality: The inclusion of DMA and WDT peripherals enhances the functionality and reliability of the AGFB006R16A2I1V. DMA allows for efficient data transfer, while WDT ensures system stability by monitoring and resetting the system if necessary.

Reliable Packaging: Packaged in a 1546FBGA format, the AGFB006R16A2I1V offers a compact and reliable solution. The moisture sensitivity level (MSL) of 3 ensures 168 hours of protection, making it suitable for use in various environmental conditions.

AGFB006R16A2I1V Applications

The AGFB006R16A2I1V is ideal for applications requiring high performance, flexibility, and extensive connectivity. Some specific use cases include:

Industrial Automation: The combination of high-speed processing and extensive connectivity makes the AGFB006R16A2I1V suitable for industrial automation systems. It can handle complex control algorithms and communicate with various sensors and actuators, ensuring efficient and reliable operation.

Embedded Systems: The versatile architecture and robust memory make the AGFB006R16A2I1V an excellent choice for embedded systems. It can be used in applications ranging from consumer electronics to automotive systems, providing a reliable and efficient solution.

Networking: With its extensive connectivity options, the AGFB006R16A2I1V is well-suited for networking applications. It can handle high-speed data transfer and communication with multiple devices, making it ideal for use in routers, switches, and other networking equipment.

Medical Devices: The AGFB006R16A2I1V's reliability and extensive connectivity make it suitable for medical devices. It can handle critical data processing and communication with various medical sensors and equipment, ensuring accurate and timely information.

Conclusion of AGFB006R16A2I1V

The AGFB006R16A2I1V is a powerful and versatile System on Chip (SoC) from Intel's Agilex F series. Its high-speed processing capabilities, flexible architecture, and extensive connectivity options make it an ideal solution for a wide range of applications. The inclusion of DMA and WDT peripherals enhances its functionality and reliability, while the compact and reliable packaging ensures ease of integration. Whether used in industrial automation, embedded systems, networking, or medical devices, the AGFB006R16A2I1V offers a robust and efficient solution, making it a standout choice in the electronics industry.

FAQ

What operating temperature range does AGFB006R16A2I1V support?
AGFB006R16A2I1V has an operating temperature range of -40°C ~ 100°C (TJ).
What package or case is AGFB006R16A2I1V available in?
Is AGFB006R16A2I1V currently in stock?
What is the standard lead time for AGFB006R16A2I1V?
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