Intel

AGFB006R16A2I3E

AGFB006R16A2I3E Description

The AGFB006R16A2I3E is an advanced FPGA IC from Intel's Agilex F series, designed to meet the demands of high-performance embedded systems. This 1.4GHz device features a robust architecture combining an MPU and FPGA, providing versatile processing capabilities. With 256KB of RAM and 384 I/Os, it offers substantial memory and connectivity options. The AGFB006R16A2I3E also includes essential peripherals such as DMA and W,DT ensuring efficient data management and system reliability. Packaged in a 1546FBGA format, it is suitable for a wide range of applications requiring compact and high-performance solutions. The device is currently active in the market, with a moisture sensitivity level (MSL) of 3, allowing for a 168-hour exposure before assembly.

AGFB006R16A2I3E Features

• High-Speed Processing: The AGFB006R16A2I3E operates at a speed of 1.4GHz, ensuring rapid data processing and execution of complex algorithms.
• Dual Architecture: Combining an MPU and FPGA, this device offers both high-speed processing and flexible programmability, making it suitable for a variety of applications.
• Substantial Memory and I/O: With 256KB of RAM and 384 I/Os, the AGFB006R1A62I3E provides ample memory and connectivity options, supporting multiple peripherals and data-intensive tasks.
• Rich Peripheral Set: Features DMA and WDT peripherals, enhancing data transfer efficiency and system reliability.
• Versatile Connectivity: Supports a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration with various external devices.
• Compact Packaging: The 1546FBGA package ensures a compact form factor, ideal for space-constrained applications.
• Moisture Sensitivity Level: MSL 3 (168 Hours) ensures the device remains stable and reliable during the assembly process.

AGFB006R16A2I3E Applications

The AGFB006R16A2I3E is ideal for applications requiring high performance, flexibility, and compact design. Its versatile architecture and connectivity options make it suitable for:

• Embedded Systems: Ideal for embedded systems in industrial automation, automotive, and IoT applications, where high-speed processing and reliable data management are critical.
• Communication Systems: Suitable for communication systems requiring high-speed data processing and multiple connectivity options, such as 5G infrastructure and network edge devices.
• Consumer Electronics: Applicable in consumer electronics, such as smart home devices, where compact design and high performance are essential.
• Medical Devices: Can be used in medical devices requiring high reliability and efficient data processing, such as diagnostic equipment and wearable health monitors.

Conclusion of AGFB006R16A2I3E

The AGFB006R16A2I3E is a powerful and versatile IC FPGA from Intel's Agilex F series, offering high-speed processing, dual architecture, substantial memory, and rich connectivity options. Its compact 1546FBGA package and MSL 3 rating make it suitable for a wide range of applications, from embedded systems to consumer electronics. The AGFB006R16A2I3E stands out for its unique combination of performance, flexibility, and reliability, making it an excellent choice for designers seeking a high-performance solution in a compact form factor.