Intel_AGFB006R24C3I3E
Intel_AGFB006R24C3I3E
original

Intel
AGFB006R24C3I3E

777-AGFB006R24C3I3E
IC FPGA AGILEX-F 2340FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
576
Peripherals
DMA, WDT
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AGFB006R24C3I3E Description

AGFB006R24C3I3E Description

The AGFB006R24C3I3E is an advanced Embedded IC Chip from Intel's Agilex F Series, designed to deliver high performance and flexibility in a compact form factor. This IC FPGA features a 1.4GHz processing speed, leveraging a dual-architecture design that combines a Micro-Processing Unit (MPU) with a Field-Programmable Gate Array (FPGA). This unique architecture allows for versatile applications, ranging from high-speed data processing to complex logic control.

AGFB006R24C3I3E Features

  • High-Speed Processing: With a clock speed of 1.4GHz, the AGFB006R24C3I3E ensures rapid data processing and efficient execution of complex algorithms.
  • Dual Architecture: The combination of MPU and FPGA provides a robust platform for both general-purpose computing and customizable logic operations.
  • Memory and I/O: Equipped with 256KB of RAM and 576 I/O ports, this IC can handle substantial data storage and communication requirements.
  • Peripheral Support: Integrated peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer) enhance system reliability and data throughput.
  • Connectivity Options: The AGFB006R24C3I3E supports a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it suitable for diverse networking and interfacing needs.
  • Packaging and Reliability: Housed in a tray package with a Moisture Sensitivity Level (MSL) of 3 (168 Hours), the IC is designed for durability and ease of integration into various electronic systems.
  • Active Product Status: As an active product, the AGFB006R24C3I3E benefits from ongoing support and updates from Intel, ensuring long-term viability and compatibility.

AGFB006R24C3I3E Applications

The AGFB006R24C3I3E is ideal for a variety of applications that demand high performance, flexibility, and reliability. Some specific use cases include:

  • Industrial Automation: The robust architecture and extensive I/O capabilities make it suitable for controlling complex machinery and processes in industrial environments.
  • Telecommunications: The high-speed processing and connectivity options enable efficient data handling and communication in telecom infrastructure.
  • Embedded Systems: The combination of MPU and FPGA allows for the development of sophisticated embedded systems that require both general-purpose computing and custom logic.
  • Networking: The support for various networking protocols makes it an excellent choice for networked devices and IoT applications.
  • Consumer Electronics: The compact form factor and high performance make it suitable for advanced consumer electronics, such as smart home devices and wearable technology.

Conclusion of AGFB006R24C3I3E

The AGFB006R24C3I3E from Intel's Agilex F Series stands out as a versatile and high-performance Embedded IC Chip. Its dual-architecture design, extensive connectivity options, and robust peripheral support make it a powerful solution for a wide range of applications. Whether used in industrial automation, telecommunications, or consumer electronics, the AGFB006R24C3I3E offers significant advantages over similar models, ensuring reliable performance and long-term compatibility.

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