Intel_AGFB006R24D2E3V
Intel_AGFB006R24D2E3V
original

Intel
AGFB006R24D2E3V

777-AGFB006R24D2E3V
IC
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
576
Peripherals
DMA, WDT
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AGFB006R24D2E3V Description

AGFB006R24D2E3V Description

The AGFB006R24D2E3V is an advanced Embedded IC Chip designed by Intel, featuring a robust architecture and versatile connectivity options. This chip operates at a speed of 1.4GHz and is built to withstand a wide operating temperature range of 0°C to 100°C (TJ), making it suitable for various industrial and embedded applications. The AGFB006R24D2E3V is part of the Agilex F series, known for its high performance and reliability.

AGFB006R24D2E3V Features

The AGFB006R24D2E3V boasts a powerful MPU and FPGA architecture, providing a flexible and scalable solution for complex computing tasks. With 256KB of RAM, it offers ample memory for data processing and storage. The chip features 576 I/O ports, enabling extensive connectivity and control capabilities. It also includes essential peripherals such as DMA and WDT, enhancing its functionality and reliability.

The AGFB006R24D2E3V supports a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This extensive connectivity makes it ideal for applications requiring multiple communication protocols. The chip is packaged in a tray format, ensuring easy handling and integration into various systems.

AGFB006R24D2E3V Applications

The AGFB006R24D2E3V is ideal for a variety of applications due to its high performance and versatile connectivity. It is particularly well-suited for industrial automation, where its robust architecture and wide temperature range ensure reliable operation in harsh environments. The chip's extensive I/O capabilities make it a perfect fit for complex control systems, such as those found in robotics and smart manufacturing.

In the realm of IoT and smart devices, the AGFB006R24D2E3V's connectivity options enable seamless integration with various sensors and communication networks. Its ability to support multiple protocols ensures compatibility with a wide range of devices and systems. Additionally, the chip's DMA and WDT features enhance its reliability and efficiency, making it suitable for applications requiring high uptime and minimal maintenance.

Conclusion of AGFB006R24D2E3V

The AGFB006R24D2E3V is a versatile and powerful Embedded IC Chip that offers significant advantages over similar models. Its combination of high operating speed, extensive connectivity options, and robust architecture make it an ideal choice for a wide range of applications, from industrial automation to IoT devices. With its active product status and support from Intel, the AGFB006R24D2E3V is a reliable and future-proof solution for embedded systems.

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