Intel_AGFB006R24D2I3V
Intel_AGFB006R24D2I3V
original

Intel
AGFB006R24D2I3V

777-AGFB006R24D2I3V
IC
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
576
Peripherals
DMA, WDT
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AGFB006R24D2I3V Description

AGFB006R24D2I3V Description

The AGFB006R24D2I3V is an advanced embedded IC chip from Intel's Agilex F series, designed to deliver exceptional performance and versatility for a wide range of applications. This IC features a 1.4GHz processing speed, leveraging a dual-architecture design that combines a Micro-Processing Unit (MPU) with a Field-Programmable Gate Array (FPGA). This unique architecture allows for both high-speed processing and flexible reconfigurability, making it ideal for complex and dynamic computing tasks.

The AGFB006R24D2I3V is equipped with 256KB of RAM, providing ample memory for efficient data handling and processing. It also boasts an impressive 576 I/O ports, enabling extensive connectivity options and the ability to interface with a variety of peripheral devices. The chip includes essential peripherals such as Direct Memory Access (DMA) and a Watchdog Timer (WDT), ensuring robust and reliable operation.

In terms of connectivity, the AGFB006R24D2I3V supports a comprehensive range of interfaces, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This extensive connectivity suite makes it highly adaptable for integration into various systems and networks. The chip is packaged in a tray format, which is ideal for bulk handling and automated assembly processes.

AGFB006R24D2I3V Features

  • High-Speed Processing: With a clock speed of 1.4GHz, the AGFB006R24D2I3V ensures rapid execution of complex tasks, making it suitable for high-performance computing environments.
  • Dual Architecture: The combination of MPU and FPGA offers both fixed-function processing and programmable logic, providing flexibility and adaptability for diverse applications.
  • Robust Memory and I/O: 256KB of RAM and 576 I/O ports provide substantial memory and extensive connectivity, enabling efficient data management and interaction with multiple peripherals.
  • Comprehensive Peripherals: Integrated DMA and WDT enhance the chip's functionality, ensuring efficient data transfer and system reliability.
  • Extensive Connectivity: Support for EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG makes the AGFB006R24D2I3V highly versatile for various communication protocols and network configurations.
  • Active Product Status: As an active product, the AGFB006R24D2I3V benefits from ongoing support and updates from Intel, ensuring long-term reliability and compatibility.

AGFB006R24D2I3V Applications

The AGFB006R24D2I3V is ideal for a variety of applications where high performance, flexibility, and extensive connectivity are required. Some specific use cases include:

  • Industrial Automation: The chip's high-speed processing and extensive I/O capabilities make it suitable for controlling complex machinery and systems in industrial environments.
  • Telecommunications: The robust connectivity options, including Ethernet and USB OTG, make it ideal for networking equipment and communication infrastructure.
  • Embedded Systems: The combination of MPU and FPGA allows for the development of sophisticated embedded systems that require both fixed and programmable logic.
  • Internet of Things (IoT): The AGFB006R24D2I3V's ability to interface with various peripherals and its extensive connectivity options make it a strong candidate for IoT devices and gateways.
  • Automotive Systems: The chip's reliability and extensive I/O capabilities make it suitable for automotive applications, such as advanced driver-assistance systems (ADAS) and in-vehicle infotainment systems.

Conclusion of AGFB006R24D2I3V

The AGFB006R24D2I3V from Intel's Agilex F series is a versatile and high-performance embedded IC chip that offers significant advantages over similar models. Its dual architecture, extensive memory, and robust connectivity options make it an ideal choice for a wide range of applications, from industrial automation to IoT devices. The chip's active product status ensures ongoing support and updates, providing long-term reliability and compatibility. For engineers and designers seeking a powerful and flexible solution for their embedded systems, the AGFB006R24D2I3V is a standout option.

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