Intel_AGFB008R16A2I2V
Intel_AGFB008R16A2I2V
original

Intel
AGFB008R16A2I2V

777-AGFB008R16A2I2V
IC FPGA AGILEX-F 1546FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
384
Peripherals
DMA, WDT
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AGFB008R16A2I2V Description

AGFB008R16A2I2V Description

The AGFB008R16A2I2V is an advanced Embedded IC Chip from Intel's Agilex F series, designed to deliver high performance and flexibility in a compact form factor. This IC features a 1.4GHz processing speed, combining a Micro Processing Unit (MPU) and Field Programmable Gate Array (FPGA) architecture. It offers 256KB of RAM, 384 I/Os, and a suite of peripherals including DMA and WDT. The AGFB008R16A2I2V is available in a 1546FBGA package and is moisture sensitivity level 3 (168 hours). It supports a wide range of connectivity options such as EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG.

AGFB008R16A2I2V Features

  • High-Speed Processing: The 1.4GHz speed ensures rapid data processing and execution of complex algorithms, making it suitable for high-performance applications.
  • Dual Architecture: The combination of MPU and FPGA architecture provides both high-speed processing and programmable logic capabilities, offering flexibility and adaptability.
  • Robust Memory and I/O: With 256KB of RAM and 384 I/Os, the AGFB008R16A2I2V can handle large data sets and multiple input/output operations simultaneously.
  • Peripheral Integration: The inclusion of DMA and WDT enhances system reliability and efficiency, ensuring smooth operation and data integrity.
  • Extensive Connectivity: The AGFB008R16A2I2V supports various connectivity options, making it versatile for different applications and environments.
  • Moisture Resistance: The MSL 3 (168 hours) rating ensures the IC remains functional in environments with varying humidity levels, enhancing its durability and reliability.

AGFB008R16A2I2V Applications

The AGFB008R16A2I2V is ideal for a range of applications where high performance, flexibility, and reliability are critical. It is particularly suited for:

  • Industrial Automation: Where real-time processing and control are essential, the AGFB008R16A2I2V can manage complex automation tasks efficiently.
  • Embedded Systems: In devices requiring high-speed processing and programmable logic, this IC can serve as a core component.
  • Networking: The extensive connectivity options make it suitable for networking applications, including routers and switches.
  • Consumer Electronics: The AGFB008R16A2I2V can be used in smart devices where compact size and high performance are required.
  • Automotive: For advanced driver-assistance systems (ADAS) and in-vehicle infotainment systems, the IC provides the necessary processing power and connectivity.

Conclusion of AGFB008R16A2I2V

The AGFB008R16A2I2V from Intel's Agilex F series is a versatile and high-performance Embedded IC Chip. Its combination of MPU and FPGA architecture, coupled with robust memory, extensive I/O capabilities, and a wide range of connectivity options, makes it a powerful solution for various applications. The AGFB008R16A2I2V stands out for its ability to handle complex tasks efficiently while maintaining high reliability and durability. Whether used in industrial automation, embedded systems, networking, consumer electronics, or automotive applications, the AGFB008R16A2I2V delivers exceptional performance and flexibility, making it a valuable asset in the electronics industry.

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