Intel_AGFB008R16A3E3E
Intel_AGFB008R16A3E3E
original

Intel
AGFB008R16A3E3E

777-AGFB008R16A3E3E
IC FPGA AGILEX-F 1546FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
384
Peripherals
DMA, WDT
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AGFB008R16A3E3E Description

AGFB008R16A3E3E Description

The AGFB008R16A3E3E is an advanced IC FPGA from Intel's Agilex F series, designed for high-performance embedded applications. This 1546FBGA packaged chip offers a robust combination of processing power, memory, and connectivity options, making it ideal for a wide range of industrial and IoT applications. With a clock speed of 1.4GHz, it ensures rapid data processing and execution of complex tasks. The device operates reliably within a temperature range of 0°C to 100°C (TJ), making it suitable for both ambient and high-temperature environments.

AGFB008R16A3E3E Features

  • High-Speed Processing: The AGFB008R16A3E3E features a clock speed of 1.4GHz, enabling rapid execution of complex algorithms and real-time data processing.
  • Robust Architecture: It combines a multi-purpose processor unit (MPU) with a field-programmable gate array (FPGA), offering flexibility and programmability for custom applications.
  • Substantial Memory: Equipped with 256KB of RAM, it provides ample memory for storing data and running multiple applications simultaneously.
  • Extensive I/O Capabilities: With 384 I/O pins, the AGFB008R16A3E3E supports a wide array of peripheral connections, enhancing its versatility.
  • Rich Peripheral Set: It includes Direct Memory Access (DMA) and Watchdog Timer (WDT) for efficient data handling and system reliability.
  • Connectivity Options: The chip supports various connectivity protocols, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration with other systems.
  • Packaging and Reliability: The AGFB008R16A3E3E is packaged in a tray format with a Moisture Sensitivity Level (MSL) of 3 (168 Hours), ensuring durability and reliability during manufacturing and storage.

AGFB008R16A3E3E Applications

The AGFB008R16A3E3E is well-suited for applications requiring high performance and flexibility. Its unique combination of MPU and FPGA architecture makes it ideal for:

  • Industrial Automation: Real-time control systems and data acquisition units.
  • IoT Devices: Smart sensors and edge computing devices.
  • Telecommunications: Base station controllers and network interface units.
  • Medical Devices: Diagnostic equipment and patient monitoring systems.
  • Automotive Systems: Advanced driver assistance systems (ADAS) and in-vehicle infotainment.

Conclusion of AGFB008R16A3E3E

The AGFB008R16A3E3E stands out in the market due to its high-speed processing capabilities, robust architecture, and extensive connectivity options. Its ability to operate reliably across a wide temperature range and its substantial memory make it a versatile choice for various embedded applications. Intel's commitment to quality and innovation ensures that the AGFB008R16A3E3E remains a top choice for engineers and designers looking to integrate advanced FPGA technology into their projects.

FAQ

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