Intel_AGFB008R24C2E3E
Intel_AGFB008R24C2E3E
original

Intel
AGFB008R24C2E3E

777-AGFB008R24C2E3E
IC FPGA AGILEX-F 2340FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
576
Peripherals
DMA, WDT
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AGFB008R24C2E3E Description

AGFB008R24C2E3E Description

The AGFB008R24C2E3E is an advanced System on Chip (SoC) from Intel's Agilex F series, designed to deliver high performance and flexibility in a compact form factor. This IC FPGA features a 1.4GHz processing speed, ensuring rapid data handling and computation capabilities. It operates within a temperature range of 0°C to 100°C (TJ), making it suitable for a wide range of environmental conditions. The architecture combines a Microprocessor Unit (MPU) and Field-Programmable Gate Array (FPGA) for versatile processing and programmability. With 256KB of RAM and 576 I/O ports, the AGFB008R24C2E3E offers robust memory and extensive connectivity options. Additional peripherals include DMA and WDT, enhancing its functionality. The product is currently active, indicating its reliability and suitability for ongoing projects.

AGFB008R24C2E3E Features

The AGFB008R24C2E3E stands out with its unique combination of features that cater to demanding applications. Its 1.4GHz speed ensures efficient processing, ideal for real-time data analysis and high-speed communication tasks. The MPU and FPGA architecture provides a blend of fixed-function processing and customizable logic, allowing for tailored solutions to specific problems. The 256KB of RAM and 576 I/O ports offer ample memory and connectivity, making it suitable for complex systems requiring multiple interfaces. The inclusion of DMA and WDT peripherals enhances data management and system reliability. Connectivity options such as EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG provide extensive communication capabilities. The product is packaged in a tray with a Moisture Sensitivity Level (MSL) of 3 (168 Hours), ensuring durability during storage and handling.

AGFB008R24C2E3E Applications

The AGFB008R24C2E3E is ideal for a variety of applications due to its versatile architecture and robust features. It excels in embedded systems requiring high-speed processing and programmable logic, such as industrial automation, where real-time control and data processing are critical. In telecommunications, the SoC can be used for baseband processing and signal routing, leveraging its extensive connectivity options. For IoT applications, the AGFB008R24C2E3E can serve as a central processing unit, managing sensor data and facilitating communication with cloud services. Its ability to handle multiple I/O operations makes it suitable for smart home systems, where various devices need to be interconnected and controlled. Additionally, the SoC can be utilized in automotive applications for advanced driver assistance systems (ADAS), where real-time data processing and reliability are paramount.

Conclusion of AGFB008R24C2E3E

The AGFB008R24C2E3E from Intel's Agilex F series is a powerful and flexible System on Chip (SoC) that offers a unique blend of processing power, programmability, and connectivity. Its 1.4GHz speed and MPU-FPGA architecture make it suitable for a wide range of applications, from industrial automation to automotive systems. With 256KB of RAM and 576 I/O ports, the SoC provides ample resources for complex systems. The inclusion of DMA and WDT peripherals further enhances its functionality, making it a reliable choice for demanding environments. The extensive connectivity options ensure seamless integration with various peripherals and communication protocols. Overall, the AGFB008R24C2E3E is an excellent choice for engineers and designers looking for a high-performance, versatile SoC solution.

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