Intel_AGFB008R24C2I3E
Intel_AGFB008R24C2I3E
original

Intel
AGFB008R24C2I3E

777-AGFB008R24C2I3E
IC FPGA AGILEX-F 2340FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
576
Peripherals
DMA, WDT
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AGFB008R24C2I3E Description

AGFB008R24C2I3E Description

The AGFB008R24C2I3E is an advanced IC FPGA from Intel's Agilex F series, designed to deliver high performance and flexibility in a compact form factor. This device is housed in a 2340FBGA package, ensuring robustness and reliability in various embedded applications. With a clock speed of 1.4GHz, it provides significant processing power, making it suitable for demanding computational tasks. The architecture combines a Microprocessor Unit (MPU) and Field-Programmable Gate Array (FPGA), offering a versatile platform for both general-purpose processing and customizable logic functions.

AGFB008R24C2I3E Features

  • High-Speed Performance: The AGFB008R24C2I3E operates at a speed of 1.4GHz, ensuring rapid data processing and efficient execution of complex algorithms.
  • Versatile Architecture: The MPU and FPGA architecture allows for a blend of traditional processing and programmable logic, providing flexibility to adapt to various application requirements.
  • Substantial RAM: Equipped with 256KB of RAM, this device can handle significant amounts of data, making it suitable for applications requiring high memory capacity.
  • Extensive I/O Capabilities: With 576 I/O pins, the AGFB008R24C2I3E offers extensive connectivity options, enabling seamless integration with a wide range of peripheral devices.
  • Rich Peripheral Set: The inclusion of DMA (Direct Memory Access) and WDT (Watchdog Timer) enhances the device's functionality and reliability.
  • Active Product Status: As an active product, the AGFB008R24C2I3E benefits from ongoing support and updates from Intel, ensuring long-term viability and compatibility.
  • Robust Connectivity Options: The device supports a variety of connectivity protocols, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating integration into diverse systems.
  • Reliable Packaging: The Tray packaging and Moisture Sensitivity Level (MSL) of 3 (168 Hours) ensure the device remains protected during storage and transportation, reducing the risk of damage.

AGFB008R24C2I3E Applications

The AGFB008R24C2I3E is ideal for a range of applications where high performance, flexibility, and extensive connectivity are paramount. Key applications include:

  • Industrial Automation: The device's high-speed processing and extensive I/O capabilities make it suitable for controlling complex machinery and systems in industrial environments.
  • Telecommunications: The robust connectivity options and high-speed performance enable the AGFB008R24C2I3E to be used in communication infrastructure, such as base stations and network routers.
  • Medical Devices: The combination of MPU and FPGA allows for the development of sophisticated medical equipment, where precise control and data processing are critical.
  • Automotive Systems: The AGFB008R24C2I3E can be utilized in advanced driver-assistance systems (ADAS) and infotainment systems, leveraging its high-speed processing and connectivity features.
  • Consumer Electronics: The device's versatility and extensive peripheral support make it suitable for a variety of consumer electronics applications, such as smart home devices and wearable technology.

Conclusion of AGFB008R24C2I3E

The AGFB008R24C2I3E from Intel's Agilex F series stands out as a powerful and versatile IC FPGA, offering a blend of high-speed processing and customizable logic functions. Its extensive I/O capabilities, substantial RAM, and rich peripheral set make it an ideal choice for a wide range of applications, from industrial automation to consumer electronics. The device's active status and robust packaging further enhance its reliability and long-term viability. For engineers and designers seeking a high-performance, flexible solution for their embedded systems, the AGFB008R24C2I3E is a compelling option.

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AGFB008R24C2I3E is a System On Chip (SoC) from Intel. This product page provides its main specifications, pricing information, availability, and inquiry options.
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