Intel_AGFB008R24D2E2V
Intel_AGFB008R24D2E2V
original

Intel
AGFB008R24D2E2V

777-AGFB008R24D2E2V
IC FPGA AGILEX-F 2340FBGA
9 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
-
Peripherals
DMA, WDT
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AGFB008R24D2E2V Description

AGFB008R24D2E2V Description

The AGFB008R24D2E2V is an advanced Embedded IC Chip from Intel's Agilex F series, designed to deliver exceptional performance and flexibility for a wide range of applications. This IC is built on a robust architecture that integrates a Multi-Processor Unit (MPU) and Field-Programmable Gate Array (FPGA), making it highly versatile for complex computing tasks. The AGFB008R24D2E2V operates at a speed of 1.4GHz, ensuring rapid processing capabilities. It features a 256KB RAM size, which is ideal for handling multiple tasks simultaneously without compromising performance. The device is designed to function efficiently within an operating temperature range of 0°C to 100°C (TJ), making it suitable for various environmental conditions.

AGFB008R24D2E2V Features

The AGFB008R24D2E2V boasts a comprehensive set of features that set it apart from similar models in the market. Key features include:

  • High-Speed Performance: With a clock speed of 1.4GHz, the AGFB008R24D2E2V ensures rapid execution of tasks, making it ideal for applications requiring real-time processing.
  • Robust Architecture: The integration of MPU and FPGA provides a flexible and powerful computing platform, capable of handling both general-purpose processing and specialized tasks.
  • Extensive Connectivity Options: The AGFB008R24D2E2V supports a wide array of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This makes it highly adaptable for various communication protocols and interfaces.
  • On-Board Peripherals: The inclusion of Direct Memory Access (DMA) and Watchdog Timer (WDT) enhances the device's functionality and reliability, ensuring efficient data handling and system stability.
  • Active Product Status: As an active product, the AGFB008R24D2E2V benefits from ongoing support and updates from Intel, ensuring long-term viability and compatibility with future technologies.
  • Packaging: The AGFB008R24D2E2V is packaged in a tray format, which is ideal for easy handling and integration into various systems.

AGFB008R24D2E2V Applications

The AGFB008R24D2E2V is highly versatile and can be applied in numerous fields where high performance and flexibility are required. Some specific use cases include:

  • Industrial Automation: The AGFB008R24D2E2V's robust architecture and extensive connectivity options make it ideal for controlling complex industrial processes, managing data acquisition systems, and interfacing with various sensors and actuators.
  • Telecommunications: In the telecommunications sector, the device can be used for signal processing, network management, and data routing, thanks to its high-speed performance and reliable connectivity.
  • Automotive Systems: The AGFB008R24D2E2V can be employed in advanced driver assistance systems (ADAS), infotainment systems, and vehicle control units, providing real-time processing and reliable performance.
  • Medical Devices: For medical applications, the AGFB008R24D2E2V can be used in diagnostic equipment, patient monitoring systems, and medical imaging devices, where accuracy and reliability are paramount.
  • Consumer Electronics: The device's flexibility and performance make it suitable for a range of consumer electronics, such as smart home devices, gaming consoles, and multimedia systems.

Conclusion of AGFB008R24D2E2V

The AGFB008R24D2E2V is a powerful and versatile Embedded IC Chip from Intel's Agilex F series, offering a unique combination of high-speed performance, robust architecture, and extensive connectivity options. Its ability to handle complex tasks efficiently and reliably makes it an ideal choice for a wide range of applications, from industrial automation to consumer electronics. With ongoing support from Intel and its active product status, the AGFB008R24D2E2V is well-positioned to meet the evolving needs of modern electronics, ensuring long-term viability and compatibility with future technologies.

FAQ

What package or case is AGFB008R24D2E2V available in?
AGFB008R24D2E2V is available in the 2340-BFBGA Exposed Pad package / case.
What is the standard lead time for AGFB008R24D2E2V?
What operating temperature range does AGFB008R24D2E2V support?
Is AGFB008R24D2E2V currently in stock?
What is AGFB008R24D2E2V?
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