Intel_AGFB012R24B2I2V
Intel_AGFB012R24B2I2V
original

Intel
AGFB012R24B2I2V

777-AGFB012R24B2I2V
IC FPGA AGILEX-F 2486FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
768
Peripherals
DMA, WDT
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AGFB012R24B2I2V Description

AGFB012R24B2I2V Description

The AGFB012R24B2I2V is an advanced embedded IC chip from Intel's Agilex F series, designed to deliver exceptional performance and flexibility for a wide range of applications. This IC FPGA features a 1.4GHz processing speed and a versatile architecture that combines a Microprocessor Unit (MPU) with Field-Programmable Gate Array (FPGA) capabilities. The chip is equipped with 256KB of RAM, providing ample memory for complex operations and data storage. It also boasts 768 I/O ports, enabling extensive connectivity options and integration with various peripheral devices.

AGFB012R24B2I2V Features

  • High-Speed Processing: The AGFB012R24B2I2V operates at a speed of 1.4GHz, ensuring rapid execution of tasks and efficient data processing.
  • Flexible Architecture: Combining MPU FPGA and functionalities, this chip offers both programmable logic and microprocessor capabilities, making it suitable for diverse applications.
  • Robust Memory: With 256KB of RAM, the AGFB012R24B2I2V can handle large datasets and complex algorithms, enhancing overall system performance.
  • Extensive I/O Capabilities: The chip features 768 I/O ports, providing extensive connectivity options for interfacing with various peripherals and systems.
  • Advanced Peripherals: Integrated Direct Memory Access (DMA) and Watchdog Timer (WDT) peripherals enhance system reliability and data management.
  • Active Product Status: As an active product, the AGFB012R24B2I2V benefits from ongoing support and updates from Intel, ensuring long-term viability and compatibility.
  • Comprehensive Connectivity: The chip supports a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration into modern embedded systems.
  • Reliable Packaging: The AGFB012R24B2I2V is packaged in a tray format with a Moisture Sensitivity Level (MSL) of 3 (168 hours), ensuring protection during storage and handling.

AGFB012R24B2I2V Applications

The AGFB012R24B2I2V is ideal for applications that require high-speed processing, extensive connectivity, and programmable logic. Some specific use cases include:

  • Industrial Automation: The chip's high-speed processing and extensive I/O capabilities make it suitable for controlling complex industrial processes and machinery.
  • Telecommunications: The AGFB012R24B2I2V can be used in network infrastructure equipment, providing reliable data processing and communication capabilities.
  • Automotive Systems: The chip's robust architecture and connectivity options make it ideal for advanced driver-assistance systems (ADAS) and in-vehicle infotainment systems.
  • Medical Devices: The AGFB012R24B2I2V can be integrated into medical imaging and diagnostic equipment, offering high-performance processing and reliable data management.
  • Consumer Electronics: The chip's versatility and extensive connectivity make it suitable for a wide range of consumer electronics, including smart home devices and wearable technology.

Conclusion of AGFB012R24B2I2V

The AGFB012R24B2I2V from Intel's Agilex F series is a powerful and versatile embedded IC chip that offers a unique combination of high-speed processing, flexible architecture, and extensive connectivity options. Its robust memory and advanced peripherals make it an ideal choice for a wide range of applications, from industrial automation to consumer electronics. With its active product status and reliable packaging, the AGFB012R24B2I2V ensures long-term viability and compatibility, making it a valuable component for modern embedded systems.

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