Intel_AGFB014R24C2E1V
Intel_AGFB014R24C2E1V
original

Intel
AGFB014R24C2E1V

777-AGFB014R24C2E1V
IC FPGA AGILEX-F 2340FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
744
Peripherals
DMA, WDT
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AGFB014R24C2E1V Description

AGFB014R24C2E1V Description

The AGFB014R24C2E1V is an advanced Embedded IC Chip from Intel's Agilex F series, designed to deliver high performance and flexibility in a compact 2340FBGA package. This IC features a powerful 1.4GHz processing speed, making it suitable for demanding applications that require rapid data processing and execution. The operating temperature range of 0°C to 100°C (TJ) ensures reliable performance across a wide range of environmental conditions, making it ideal for both industrial and consumer applications.

AGFB014R24C2E1V Features

  • High-Performance Architecture: The AGFB014R24C2E1V combines a MPU (MicroProcessing Unit) with an FPGA (Field-Programmable Gate Array), offering a versatile and powerful architecture for complex processing tasks.
  • Substantial RAM Capacity: Equipped with 256KB of RAM, this IC can handle large datasets and complex algorithms efficiently.
  • Extensive I/O Capabilities: With 744 I/O pins, the AGFB014R24C2E1V provides ample connectivity options, enabling seamless integration with various peripherals and systems.
  • Comprehensive Peripherals: Features include DMA (Direct Memory Access) and WDT (Watchdog Timer), enhancing system performance and reliability.
  • Active Product Status: As an active product, the AGFB014R24C2E1V benefits from ongoing support and updates from Intel, ensuring long-term viability and compatibility.
  • Robust Connectivity Options: The AGFB014R24C2E1V supports a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating versatile and flexible system designs.
  • Packaging and Environmental Protection: The IC is packaged in a tray format with a Moisture Sensitivity Level (MSL) of 3 (168 Hours), ensuring protection during storage and handling.

AGFB014R24C2E1V Applications

The AGFB014R24C2E1V is well-suited for a variety of applications due to its high performance, extensive connectivity, and robust architecture. Some specific use cases include:

  • Industrial Automation: The combination of high processing speed and extensive I/O capabilities makes it ideal for controlling complex industrial processes and machinery.
  • Telecommunications: The AGFB014R24C2E1V can be used in base stations, routers, and other telecom equipment, leveraging its Ethernet and USB OTG connectivity for efficient data transmission and management.
  • Consumer Electronics: The IC's flexibility and performance make it suitable for advanced consumer devices such as smart home systems, gaming consoles, and high-end multimedia devices.
  • Automotive Systems: The wide operating temperature range and robust connectivity options make it a strong candidate for automotive applications, including infotainment systems and advanced driver assistance systems (ADAS).

Conclusion of AGFB014R24C2E1V

The AGFB014R24C2E1V from Intel's Agilex F series is a versatile and powerful Embedded IC Chip that offers a unique blend of high performance, extensive connectivity, and robust architecture. Its 1.4GHz processing speed, 256KB RAM, and 744 I/O pins make it an excellent choice for a wide range of applications, from industrial automation to consumer electronics. The inclusion of DMA and WDT peripherals further enhances its reliability and efficiency. With its active product status and ongoing support from Intel, the AGFB014R24C2E1V is a reliable and future-proof solution for modern electronic systems.

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What is AGFB014R24C2E1V?
AGFB014R24C2E1V is a System On Chip (SoC) from Intel. This product page provides its main specifications, pricing information, availability, and inquiry options.
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