Intel_AGFB014R24C2E3E
Intel_AGFB014R24C2E3E
original

Intel
AGFB014R24C2E3E

777-AGFB014R24C2E3E
IC FPGA AGILEX-F 2340FBGA
12 Weeks

Why Choose Us?

Professional Platform

B2B & B2C purchasing

Delivery at full speed

1-2 days delivery

Wide variety

Original manufacturers

365 days guarantee

Responsible quality
APAC
ISO9001
Quality Policy
ISO45001
ISO14001
Original

Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
744
Peripherals
DMA, WDT
Show More

AGFB014R24C2E3E Description

AGFB014R24C2E3E Description

The AGFB014R24C2E3E is an advanced embedded IC chip from Intel's Agilex F series, designed to deliver high performance and flexibility in a compact form factor. This IC features a 1.4GHz processing speed, making it suitable for demanding applications that require rapid data processing and execution. The operating temperature range of 0°C to 100°C (TJ) ensures reliable performance across a wide range of environmental conditions, making it ideal for both industrial and consumer applications.

The AGFB014R24C2E3E combines a microprocessor unit (MPU) with Field-Programmable Gate Array (FPGA) architecture, offering the best of both worlds: the programmability and flexibility of an FPGA with the processing capabilities of a traditional MPU. This dual architecture allows for efficient handling of complex tasks and real-time processing requirements. The chip is equipped with 256KB of RAM, providing ample memory for storing data and instructions, and supports 744 I/O pins, enabling extensive connectivity options.

AGFB014R24C2E3E Features

  • High-Speed Processing: The 1.4GHz speed ensures that the AGFB014R24C2E3E can handle high-frequency operations, making it suitable for applications requiring real-time data processing and rapid execution.
  • Wide Operating Temperature Range: With an operating temperature range of 0°C to 100°C (TJ), this IC is designed to perform reliably in various environmental conditions, from freezing to extremely hot environments.
  • Dual Architecture: The combination of MPU and FPGA architecture provides both the flexibility of programmable logic and the robust processing power of a microprocessor, offering a versatile solution for complex applications.
  • Robust Memory and I/O: The 256KB of RAM and 744 I/O pins provide ample memory and extensive connectivity options, enabling the AGFB014R24C2E3E to handle multiple tasks and interface with a variety of peripherals.
  • Advanced Peripherals: The inclusion of DMA (Direct Memory Access) and WDT (Watchdog Timer) enhances the chip's capabilities, allowing for efficient data transfer and system monitoring.
  • Active Product Status: The AGFB014R24C2E3E is currently in active production, ensuring availability and support for ongoing projects.
  • Connectivity Options: The chip supports a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly adaptable for various applications.
  • Packaging and Sensitivity: The AGFB014R24C2E3E is packaged in a tray with a Moisture Sensitivity Level (MSL) of 3 (168 Hours), ensuring safe handling and storage.

AGFB014R24C2E3E Applications

The AGFB014R24C2E3E is ideal for a variety of applications due to its high performance, flexibility, and extensive connectivity options. Some specific use cases include:

  • Industrial Automation: The robust performance and wide temperature range make it suitable for industrial control systems, where reliability and real-time processing are critical.
  • Embedded Systems: The combination of MPU and FPGA architecture allows for the development of sophisticated embedded systems that require both programmable logic and high-speed processing.
  • Networking and Communication: The extensive connectivity options, including Ethernet and USB OTG, make it ideal for networking equipment and communication devices.
  • Consumer Electronics: The AGFB014R24C2E3E can be used in consumer electronics where high performance and low power consumption are required, such as smart home devices and wearable technology.
  • Automotive Systems: The chip's ability to handle multiple tasks and interface with various peripherals makes it suitable for automotive applications, such as advanced driver-assistance systems (ADAS) and infotainment systems.

Conclusion of AGFB014R24C2E3E

The AGFB014R24C2E3E from Intel's Agilex F series is a versatile and high-performance embedded IC chip that offers a unique combination of MPU and FPGA architecture. Its 1.4GHz processing speed, wide operating temperature range, and extensive connectivity options make it suitable for a wide range of applications, from industrial automation to consumer electronics. The inclusion of advanced peripherals and robust memory further enhance its capabilities, making it a standout choice in the market. For projects requiring flexibility, high performance, and reliable operation, the AGFB014R24C2E3E is an excellent solution.

FAQ

What package or case is AGFB014R24C2E3E available in?
AGFB014R24C2E3E is available in the - package / case.
Are there related or alternative parts for AGFB014R24C2E3E?
Is AGFB014R24C2E3E currently in stock?
What is the standard lead time for AGFB014R24C2E3E?
What is AGFB014R24C2E3E?
Quick Quote
ADD TO RFQ LIST

Not available to buy online? Want the lower wholesale price? Please Send RFQ to get best price, we will respond immediately

QUICK RFQ