Intel_AGFB014R24C3I3E
Intel_AGFB014R24C3I3E
original

Intel
AGFB014R24C3I3E

777-AGFB014R24C3I3E
IC FPGA AGILEX-F 2340FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
744
Peripherals
DMA, WDT
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AGFB014R24C3I3E Description

AGFB014R24C3I3E Description

The AGFB014R24C3I3E is a high-performance System on Chip (SoC) from Intel's Agilex F series, designed to deliver exceptional processing capabilities and flexibility in a compact form factor. This IC FPGA features a 1.4GHz processing speed, ensuring rapid data handling and execution of complex tasks. Its architecture combines a Micro Processing Unit (MPU) with Field-Programmable Gate Array (FPGA) technology, offering a versatile platform for both general-purpose computing and customizable hardware acceleration.

AGFB014R24C3I3E Features

  • High-Speed Processing: The AGFB014R24C3I3E operates at a speed of 1.4GHz, providing robust performance for demanding applications.
  • Flexible Architecture: Combining MPU and FPGA, this SoC offers a balance of programmable logic and traditional processing power, making it suitable for a wide range of applications.
  • Substantial RAM: With 256KB of RAM, the device can handle significant data storage and processing tasks efficiently.
  • Extensive I/O Capabilities: The AGFB014R24C3I3E boasts 744 I/O pins, enabling extensive connectivity options and the ability to interface with numerous peripherals.
  • Rich Peripheral Set: Integrated peripherals include DMA (Direct Memory Access) and WDT (Watchdog Timer), enhancing the device's functionality and reliability.
  • Active Product Status: As an active product, the AGFB014R24C3I3E benefits from ongoing support and updates from Intel.
  • Advanced Connectivity: The SoC supports a variety of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration into modern systems.
  • Packaging and Reliability: The AGFB014R24C3I3E is packaged in a tray format with a Moisture Sensitivity Level (MSL) of 3 (168 Hours), ensuring durability and reliability in various environments.

AGFB014R24C3I3E Applications

The AGFB014R24C3I3E is ideal for applications requiring high-speed processing and customizable hardware acceleration. Its extensive I/O capabilities and rich peripheral set make it suitable for:

  • Embedded Systems: Ideal for embedded applications where compact size, high performance, and flexibility are crucial.
  • Industrial Automation: Can be used in industrial control systems, where real-time processing and robust connectivity are essential.
  • Communication Systems: Perfect for networking and communication applications, leveraging its advanced connectivity options.
  • Consumer Electronics: Suitable for high-end consumer devices that require powerful processing and customizable features.
  • Automotive Applications: Beneficial in automotive systems where reliability, performance, and extensive connectivity are paramount.

Conclusion of AGFB014R24C3I3E

The AGFB014R24C3I3E stands out as a versatile and powerful SoC, offering a unique blend of MPU and FPGA capabilities. Its high processing speed, substantial RAM, and extensive I/O options make it a standout choice for a variety of applications. The inclusion of advanced connectivity features and robust peripherals further enhances its appeal. For engineers and designers seeking a reliable, high-performance solution, the AGFB014R24C3I3E is an excellent choice, providing the flexibility and power needed to drive innovation in modern electronic systems.

FAQ

What is the standard lead time for AGFB014R24C3I3E?
The standard lead time for AGFB014R24C3I3E is 12 Weeks.
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Is AGFB014R24C3I3E currently in stock?
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