Intel_AGFB019R24C2I1V
Intel_AGFB019R24C2I1V
original

Intel
AGFB019R24C2I1V

777-AGFB019R24C2I1V
IC
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFB019R24C2I1V Description

AGFB019R24C2I1V Description

The AGFB019R24C2I1V is a high-performance System on Chip (SoC) from Intel's Agilex F series, designed to deliver exceptional processing capabilities and versatile connectivity options. This IC is equipped with a 1.4GHz processing speed, ensuring rapid data handling and efficient execution of complex tasks. The architecture combines a Microprocessor Unit (MPU) with Field-Programmable Gate Array (FPGA) technology, offering a flexible and powerful platform for a wide range of applications.

AGFB019R24C2I1V Features

  • Performance: The AGFB019R24C2I1V boasts a 1.4GHz processing speed, making it ideal for applications requiring high computational power. Its MPU and FPGA architecture allows for both deterministic processing and reconfigurable logic, providing a balance between performance and flexibility.
  • Memory: With 256KB of RAM, this SoC can handle substantial data storage and processing tasks, ensuring smooth operation even with multiple applications running concurrently.
  • Connectivity: The AGFB019R24C2I1V offers extensive connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This wide range of interfaces makes it suitable for integration into various systems and networks.
  • I/O Capability: The SoC features 480 I/Os, providing ample connections for peripheral devices and ensuring robust communication capabilities.
  • Peripherals: Integrated peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer) enhance the SoC's functionality and reliability.
  • Packaging: The AGFB019R24C2I1V is packaged in a tray, which is ideal for automated assembly processes and ensures the IC is protected during handling and storage.
  • Product Status: Currently in an active status, this SoC is ready for deployment in new and existing projects, with full support from Intel.

AGFB019R24C2I1V Applications

The AGFB019R24C2I1V is well-suited for a variety of applications due to its high performance and versatile connectivity. Some specific use cases include:

  • Embedded Systems: Ideal for embedded systems requiring high processing power and efficient memory management. The SoC's architecture allows for seamless integration into devices such as smart meters, industrial controllers, and medical equipment.
  • Networking: The extensive connectivity options make it suitable for networking applications, including routers, switches, and network interface cards. The Ethernet and USB OTG interfaces facilitate high-speed data transfer and connectivity.
  • Consumer Electronics: The AGFB019R24C2I1V can be used in consumer electronics such as smart TVs, gaming consoles, and advanced multimedia devices, where high-speed processing and multiple I/O options are crucial.
  • Automotive: In the automotive industry, this SoC can be utilized in advanced driver-assistance systems (ADAS), infotainment systems, and electronic control units (ECUs), providing reliable performance and connectivity.

Conclusion of AGFB019R24C2I1V

The AGFB019R24C2I1V is a robust and versatile SoC from Intel's Agilex F series, offering a combination of high processing speed, flexible architecture, and extensive connectivity options. Its 1.4GHz speed and MPU-FPGA architecture ensure it can handle demanding tasks while maintaining flexibility for various applications. With 256KB of RAM and 480 I/Os, it provides ample resources for data storage and communication. The integrated peripherals and tray packaging further enhance its functionality and ease of use. Whether for embedded systems, networking, consumer electronics, or automotive applications, the AGFB019R24C2I1V stands out as a reliable and high-performance solution, making it an excellent choice for engineers and designers in the electronics industry.

FAQ

What is the standard lead time for AGFB019R24C2I1V?
The standard lead time for AGFB019R24C2I1V is 12 Weeks.
What operating temperature range does AGFB019R24C2I1V support?
Is AGFB019R24C2I1V currently in stock?
Are there related or alternative parts for AGFB019R24C2I1V?
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