Intel_AGFB019R24C2I3V
Intel_AGFB019R24C2I3V
original

Intel
AGFB019R24C2I3V

777-AGFB019R24C2I3V
IC FPGA AGILEX-F 2340BGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFB019R24C2I3V Description

AGFB019R24C2I3V Description

The AGFB019R24C2I3V is an advanced Embedded IC Chip from Intel's Agilex F series, designed to offer high performance and flexibility for a wide range of applications. This IC FPGA features a robust architecture combining MPU and FPGA capabilities, making it ideal for complex embedded systems. With a clock speed of 1.4GHz, it delivers significant processing power, ensuring efficient handling of multiple tasks simultaneously. The device is equipped with 256KB of RAM, providing ample memory for data storage and processing. It supports 480 I/Os, which is a substantial number, allowing for extensive connectivity options. The AGFB019R24C2I3V also includes essential peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer), enhancing its functionality and reliability. The product is currently active and available in a tray package, making it suitable for various manufacturing processes.

AGFB019R24C2I3V Features

The AGFB019R24C2I3V boasts several unique features that set it apart from similar models in the market. Its architecture, which combines MPU and FPGA, offers a versatile platform capable of handling both general-purpose processing and specialized tasks. This dual-architecture approach allows for optimized performance and resource utilization. The 1.4GHz speed ensures that the device can handle high-frequency operations, making it suitable for real-time processing and high-speed data transfer. The 256KB of RAM provides sufficient memory for embedded applications, allowing for efficient data handling and processing. The extensive number of I/Os (480) offers unparalleled connectivity options, enabling the integration of multiple peripherals and interfaces. The inclusion of DMA and WDT peripherals further enhances the device's functionality, providing efficient data transfer and system monitoring capabilities. Additionally, the AGFB019R24C2I3V supports a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly adaptable to various system requirements.

AGFB019R24C2I3V Applications

The AGFB019R24C2I3V is ideal for a variety of applications due to its high performance and extensive connectivity options. It is particularly well-suited for industrial automation systems, where real-time processing and high-speed data transfer are critical. The device's robust architecture and extensive I/O capabilities make it an excellent choice for embedded systems in the automotive industry, where it can handle complex tasks such as sensor data processing and vehicle control systems. The AGFB019R24C2I3V is also suitable for consumer electronics, where its high-speed processing and connectivity options can enhance the performance of devices such as smart TVs and gaming consoles. Additionally, its versatility makes it a strong candidate for use in IoT (Internet of Things) applications, where it can manage multiple sensors and communicate with various devices over different interfaces.

Conclusion of AGFB019R24C2I3V

In conclusion, the AGFB019R24C2I3V from Intel's Agilex F series is a powerful and versatile Embedded IC Chip that offers significant performance benefits and extensive connectivity options. Its dual-architecture approach, combining MPU and FPGA, provides a flexible platform capable of handling a wide range of tasks. The device's high clock speed, ample RAM, and extensive I/O capabilities make it an ideal choice for complex embedded systems in various industries, including industrial automation, automotive, consumer electronics, and IoT. The AGFB019R24C2I3V's unique features and advantages over similar models make it a standout product in the electronics industry, offering reliable performance and adaptability for future technological advancements.

FAQ

What is the standard lead time for AGFB019R24C2I3V?
The standard lead time for AGFB019R24C2I3V is 12 Weeks.
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What operating temperature range does AGFB019R24C2I3V support?
Is AGFB019R24C2I3V currently in stock?
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