Intel_AGFB019R31C2I2V
Intel_AGFB019R31C2I2V
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Intel
AGFB019R31C2I2V

777-AGFB019R31C2I2V
IC FPGA AGILEX-F 3184FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFB019R31C2I2V Description

AGFB019R31C2I2V Description

The AGFB019R31C2I2V is an advanced embedded IC chip from Intel's Agilex F series, designed to deliver exceptional performance and versatility in a compact form factor. This IC FPGA features a 1.4GHz processing speed, powered by a combination of MPU and FPGA architecture, making it suitable for complex, high-speed applications. The chip includes 256KB of RAM, providing ample memory for data storage and processing tasks. With 480 I/O ports, the AGFB019R31C2I2V offers extensive connectivity options, allowing seamless integration with various peripherals and systems.

AGFB019R31C2I2V Features

  • High-Speed Performance: The AGFB019R31C2I2V operates at a speed of 1.4GHz, ensuring rapid processing capabilities that are essential for demanding applications.
  • Dual Architecture: Combining MPU and FPGA architecture, this chip offers the flexibility to handle both general-purpose processing and specialized, parallel processing tasks.
  • Robust Memory: Equipped with 256KB of RAM, the AGFB019R31C2I2V can efficiently manage data storage and retrieval, enhancing overall system performance.
  • Extensive I/O Connectivity: With 480 I/O ports, this IC chip provides a wide range of connectivity options, facilitating integration with various peripherals and systems.
  • Advanced Peripherals: The AGFB019R31C2I2V includes DMA and WDT peripherals, enhancing data management and system reliability.
  • Active Product Status: As an active product, the AGFB019R31C2I2V is supported by Intel, ensuring ongoing updates and compatibility with future technologies.
  • Versatile Connectivity Options: The chip supports EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly adaptable for different use cases.
  • Packaging: The AGFB019R31C2I2V is available in a tray package, which is ideal for bulk handling and integration into various electronic systems.

AGFB019R31C2I2V Applications

The AGFB019R31C2I2V is ideal for a wide range of applications, including:

  • Industrial Automation: Its high-speed processing and extensive I/O capabilities make it suitable for controlling complex machinery and systems in industrial environments.
  • Telecommunications: The chip's advanced connectivity options and high performance are perfect for managing data transmission and processing in telecommunications infrastructure.
  • Automotive Systems: The AGFB019R31C2I2V can be used in advanced driver-assistance systems (ADAS) and infotainment systems, providing reliable and efficient processing power.
  • Medical Devices: Its robust architecture and extensive peripherals make it ideal for medical imaging and diagnostic equipment, where precision and reliability are critical.
  • Consumer Electronics: The chip's versatility and high performance make it suitable for a variety of consumer electronics, including smart home devices and wearable technology.

Conclusion of AGFB019R31C2I2V

The AGFB019R31C2I2V from Intel's Agilex F series is a powerful and versatile embedded IC chip, offering a unique combination of high-speed processing, extensive connectivity, and robust memory. Its dual architecture and advanced peripherals make it a superior choice over similar models, providing unmatched flexibility and performance. Whether used in industrial automation, telecommunications, automotive systems, medical devices, or consumer electronics, the AGFB019R31C2I2V delivers reliable and efficient processing capabilities, making it an ideal solution for a wide range of applications.

FAQ

What is AGFB019R31C2I2V?
AGFB019R31C2I2V is a System On Chip (SoC) from Intel. This product page provides its main specifications, pricing information, availability, and inquiry options.
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