Intel_AGFB019R31C3E4X
Intel_AGFB019R31C3E4X
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Intel
AGFB019R31C3E4X

777-AGFB019R31C3E4X
IC FPGA AGILEX-F 3184FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFB019R31C3E4X Description

AGFB019R31C3E4X Description

The AGFB019R31C3E4X is an advanced IC FPGA from Intel's Agilex F series, designed for high-performance embedded applications. This 3184FBGA packaged device offers a robust combination of processing power, flexibility, and connectivity options, making it ideal for a wide range of demanding applications. With a clock speed of 1.4GHz, the AGFB019R31C3E4X ensures rapid data processing and efficient execution of complex tasks. The device operates within a temperature range of 0°C to 100°C (TJ), making it suitable for both standard and rugged environments.

AGFB019R31C3E4X Features

  • High-Speed Processing: The AGFB019R31C3E4X boasts a clock speed of 1.4GHz, providing rapid data processing capabilities that are essential for real-time applications.
  • Wide Operating Temperature Range: With an operating temperature range of 0°C to 100°C (TJ), the device is suitable for applications in both standard and extreme environments.
  • Dual Architecture: The combination of MPU and FPGA architecture offers both high-level processing and programmable logic capabilities, enabling versatile and efficient system designs.
  • Substantial RAM: The device features 256KB of RAM, providing ample memory for data storage and processing.
  • Extensive I/O Capabilities: The AGFB019R31C3E4X supports 480 I/Os, offering extensive connectivity options for various peripherals and interfaces.
  • Rich Peripheral Set: The device includes DMA and WDT peripherals, enhancing its functionality and reliability in embedded systems.
  • Active Product Status: The AGFB019R31C3E4X is an active product, ensuring continued support and availability for ongoing projects.
  • Advanced Connectivity Options: The device supports a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration with various systems.
  • Tray Packaging: The AGFB019R31C3E4X is packaged in a tray, ensuring safe and reliable handling during manufacturing and assembly processes.

AGFB019R31C3E4X Applications

The AGFB019R31C3E4X is ideal for a variety of applications that require high performance, flexibility, and robust connectivity. Some specific use cases include:

  • Industrial Automation: The device's high-speed processing and extensive connectivity options make it suitable for controlling complex industrial processes and machinery.
  • Telecommunications: The AGFB019R31C3E4X can be used in telecommunications infrastructure, such as base stations and network switches, where high-speed data processing and reliable connectivity are critical.
  • Automotive Systems: The device's wide operating temperature range and robust architecture make it suitable for automotive applications, including advanced driver assistance systems (ADAS) and in-vehicle infotainment (IVI) systems.
  • Medical Devices: The AGFB019R31C3E4X can be used in medical imaging and diagnostic equipment, where high-speed data processing and reliable operation are essential.
  • Consumer Electronics: The device's versatile architecture and connectivity options make it suitable for a wide range of consumer electronics applications, such as smart home devices and wearable technology.

Conclusion of AGFB019R31C3E4X

The AGFB019R31C3E4X is a highly capable IC FPGA that offers a unique combination of high-speed processing, flexible architecture, and extensive connectivity options. Its robust performance and wide operating temperature range make it suitable for a variety of demanding applications in industrial, telecommunications, automotive, medical, and consumer electronics sectors. The device's active product status ensures ongoing support and availability, making it a reliable choice for both current and future projects. With its advanced features and versatile capabilities, the AGFB019R31C3E4X stands out as a superior option in the embedded IC chips market.

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