Intel_AGFB022R31C2E2VAA
Intel_AGFB022R31C2E2VAA
original

Intel
AGFB022R31C2E2VAA

777-AGFB022R31C2E2VAA
IC FPGA AGILEX-F 3184FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
720
Peripherals
DMA, WDT
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AGFB022R31C2E2VAA Description

AGFB022R31C2E2VAA Description

The AGFB022R31C2E2VAA is an advanced embedded IC chip from Intel's Agilex F series, designed to deliver high performance and flexibility in a compact form factor. This IC FPGA features a 1.4GHz processing speed and operates within a temperature range of 0°C to 100°C (TJ), making it suitable for a wide range of industrial and commercial applications. The architecture combines a powerful MPU with an FPGA, providing both high computational capabilities and programmable logic flexibility.

AGFB022R31C2E2VAA Features

The AGFB022R31C2E2VAA integrates 256KB of RAM, offering ample memory for complex operations and data processing. It supports 720 I/O channels, which significantly enhances its connectivity and interface capabilities. The chip includes essential peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer), enabling efficient data handling and system reliability.

The connectivity options are extensive, featuring EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This rich set of interfaces ensures seamless integration with various peripheral devices and systems. The chip is packaged in a 3184FBGA format, which is known for its robustness and thermal performance. The moisture sensitivity level (MSL) is rated at 3 (168 hours), ensuring the chip's reliability in various environmental conditions.

AGFB022R31C2E2VAA Applications

The AGFB022R31C2E2VAA is ideal for applications requiring high-speed processing and flexible programmable logic. Its combination of MPU and FPGA architecture makes it suitable for embedded systems, industrial automation, and IoT devices. The extensive I/O capabilities and connectivity options make it a versatile choice for applications such as:

  • Industrial Control Systems: The robust architecture and wide operating temperature range make it suitable for industrial environments where reliability and performance are critical.
  • IoT Gateways: The rich set of connectivity options allows it to serve as a central hub for IoT devices, aggregating and processing data from multiple sensors and actuators.
  • Embedded Systems: The integrated RAM and peripherals enable it to handle complex tasks in embedded systems, such as real-time data processing and control.

Conclusion of AGFB022R31C2E2VAA

The AGFB022R31C2E2VAA from Intel's Agilex F series stands out for its high processing speed, extensive I/O capabilities, and versatile connectivity options. Its combination of MPU and FPGA architecture offers a unique blend of computational power and programmable logic flexibility, making it a superior choice over similar models. The chip's wide operating temperature range and robust packaging ensure its reliability in diverse environments. Whether used in industrial control systems, IoT gateways, or embedded systems, the AGFB022R31C2E2VAA delivers exceptional performance and flexibility, making it a valuable component in modern electronics design.

FAQ

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The standard lead time for AGFB022R31C2E2VAA is 12 Weeks.
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What operating temperature range does AGFB022R31C2E2VAA support?
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