Intel_AGFB022R31C2I2VAA
Intel_AGFB022R31C2I2VAA
original

Intel
AGFB022R31C2I2VAA

777-AGFB022R31C2I2VAA
IC FPGA AGILEX-F 3184FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
720
Peripherals
DMA, WDT
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AGFB022R31C2I2VAA Description

AGFB022R31C2I2VAA Description

The AGFB022R31C2I2VAA is an advanced Embedded IC Chip from Intel's Agilex F series, designed to deliver high performance and flexibility for a wide range of applications. This IC features a 1.4GHz processing speed, combining a powerful MPU (MicroProcessing Unit) with an FPGA (Field-Programmable Gate Array) architecture. The device is equipped with 256KB of RAM, providing ample memory for complex operations and data storage. It supports a robust set of peripherals, including DMA (Direct Memory Access) and WDT (Watchdog Timer), ensuring efficient data handling and system reliability.

The AGFB022R31C2I2VAA boasts 720 I/O pins, offering extensive connectivity options. Its connectivity features include EBI/EMI (External Bus Interface/External Memory Interface), Ethernet, I2C (Inter-Integrated Circuit), MMC/SD/SDIO (MultiMediaCard/Secure Digital/Secure Digital Input Output), SPI (Serial Peripheral Interface), UART/USART (Universal Asynchronous Receiver/Transmitter/Universal Synchronous Asynchronous Receiver Transmitter), and USB OTG (On-The-Go), making it highly versatile for various communication protocols. The product is packaged in a 3184FBGA (Flip-Chip Ball Grid Array) format and is available in a tray package, with a Moisture Sensitivity Level (MSL) of 3 (168 Hours), ensuring safe handling and storage.

AGFB022R31C2I2VAA Features

  • High-Speed Processing: With a 1.4GHz speed, the AGFB022R31C2I2VAA ensures rapid execution of tasks, making it suitable for demanding applications requiring high computational power.
  • Dual Architecture: The combination of MPU and FPGA architecture provides both high-performance processing and programmable flexibility, allowing for customized solutions tailored to specific needs.
  • Robust Memory and I/O: The 256KB of RAM and 720 I/O pins offer significant memory capacity and extensive connectivity, supporting complex operations and multiple peripheral devices.
  • Comprehensive Connectivity: The AGFB022R31C2I2VAA supports a wide range of communication protocols, including Ethernet, I2C, SPI, and USB OTG, facilitating seamless integration into various systems.
  • Reliable Peripherals: Features such as DMA and WDT enhance system reliability and efficiency, ensuring smooth operation and data integrity.
  • Active Product Status: As an active product, the AGFB022R31C2I2VAA benefits from ongoing support and updates from Intel, ensuring long-term viability and compatibility.

AGFB022R31C2I2VAA Applications

The AGFB022R31C2I2VAA is ideal for a variety of applications due to its high performance, flexibility, and extensive connectivity options. Some specific use cases include:

  • Industrial Automation: The device's robust I/O and connectivity options make it well-suited for controlling and monitoring industrial processes, where real-time data processing and communication are critical.
  • Telecommunications: The AGFB022R31C2I2VAA can be used in base stations and network equipment, leveraging its high-speed processing and Ethernet capabilities for efficient data transmission and management.
  • Automotive Systems: The combination of MPU and FPGA architecture allows for customizable solutions in automotive applications, such as advanced driver-assistance systems (ADAS) and infotainment systems.
  • Medical Devices: The AGFB022R31C2I2VAA's high performance and reliability make it suitable for medical imaging and diagnostic equipment, where precise data processing and system stability are paramount.
  • Consumer Electronics: The device's extensive connectivity options and programmable flexibility enable it to be used in a wide range of consumer electronics, from smart home devices to high-end multimedia systems.

Conclusion of AGFB022R31C2I2VAA

The AGFB022R31C2I2VAA is a versatile and high-performance Embedded IC Chip from Intel's Agilex F series, offering a unique combination of MPU and FPGA architecture. Its 1.4GHz processing speed, 256KB of RAM, and extensive connectivity options make it suitable for a wide range of applications, from industrial automation to consumer electronics. The device's robust peripherals and active product status ensure long-term reliability and support. With its high performance, flexibility, and extensive feature set, the AGFB022R31C2I2VAA stands out as a reliable choice for engineers and designers seeking a powerful and adaptable solution for their projects.

FAQ

What is the standard lead time for AGFB022R31C2I2VAA?
The standard lead time for AGFB022R31C2I2VAA is 12 Weeks.
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What operating temperature range does AGFB022R31C2I2VAA support?
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