Intel_AGFB023R24C2E3E
Intel_AGFB023R24C2E3E
original

Intel
AGFB023R24C2E3E

777-AGFB023R24C2E3E
IC FPGA AGILEX-F 2340BGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFB023R24C2E3E Description

AGFB023R24C2E3E Description

The AGFB023R24C2E3E is an advanced IC FPGA from Intel's Agilex F series, designed to meet the demands of high-performance embedded systems. This device features a 1.4GHz processing speed, ensuring rapid data handling and execution of complex tasks. It operates within a temperature range of 0°C to 100°C (TJ), making it suitable for a variety of industrial and commercial applications where environmental conditions can vary significantly.

The architecture of the AGFB023R24C2E3E combines a Microprocessor Unit (MPU) with Field Programmable Gate Array (FPGA) capabilities, offering both high computational power and the flexibility to customize logic functions. With 256KB of RAM, this IC can efficiently manage data storage and retrieval, supporting multiple processes simultaneously. The device also boasts 480 I/O pins, providing extensive connectivity options for interfacing with various peripherals and systems.

AGFB023R24C2E3E Features

  • High-Speed Processing: The 1.4GHz speed ensures that the AGFB023R24C2E3E can handle demanding computational tasks with ease, making it ideal for real-time processing and high-frequency data handling.
  • Wide Operating Temperature Range: The 0°C to 100°C (TJ) operating temperature range makes this IC suitable for applications in diverse environments, from cold industrial settings to high-temperature manufacturing processes.
  • Flexible Architecture: The combination of MPU and FPGA architecture offers a balance between fixed processing power and customizable logic, allowing developers to optimize the device for specific tasks.
  • Robust Connectivity: The AGFB023R24C2E3E supports a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration with other components and systems.
  • Peripheral Support: Integrated peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer) enhance the device's functionality and reliability, ensuring efficient data management and system stability.
  • Active Product Status: As an active product in Intel's Agilex F series, the AGFB023R24C2E3E benefits from ongoing support and updates, ensuring long-term viability and compatibility with future technologies.

AGFB023R24C2E3E Applications

The AGFB023R24C2E3E is well-suited for a variety of applications that require high performance, flexibility, and robust connectivity. Some specific use cases include:

  • Industrial Automation: The device's wide temperature range and extensive I/O capabilities make it ideal for controlling and monitoring industrial processes, where reliability and real-time performance are critical.
  • Embedded Systems: The combination of MPU and FPGA architecture allows for the development of sophisticated embedded systems that can handle multiple tasks simultaneously, from data processing to real-time control.
  • Networking and Communication: The support for Ethernet and USB OTG makes the AGFB023R24C2E3E suitable for networked devices and communication systems, where high-speed data transfer and connectivity are essential.
  • Consumer Electronics: The device's flexibility and high performance make it a good fit for consumer electronics, where custom logic and efficient data handling are required to enhance user experience.

Conclusion of AGFB023R24C2E3E

The AGFB023R24C2E3E is a versatile and powerful IC FPGA that stands out in the Agilex F series due to its high-speed processing capabilities, wide operating temperature range, and flexible architecture. Its extensive connectivity options and integrated peripherals further enhance its functionality, making it suitable for a broad range of applications. Whether used in industrial automation, embedded systems, networking, or consumer electronics, the AGFB023R24C2E3E offers a reliable and high-performance solution that can be tailored to meet specific needs.

FAQ

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The standard lead time for AGFB023R24C2E3E is 12 Weeks.
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