Intel

AGFB023R25A3I3E

AGFB023R25A3I3E Description

The AGFB023R25A3I3E is a high-performance System on Chip (SoC) from Intel's Agilex F series, designed to deliver exceptional processing capabilities and flexibility for a wide range of applications. This IC FPGA features a 1.4GHz clock speed, powered by a combination of MPU and FPGA architecture, ensuring robust computational power and programmability. With 256KB of RAM, it provides ample memory for efficient data handling and processing. The device boasts 480 I/Os, offering extensive connectivity options, and includes essential peripherals such as DMA and WDT for enhanced functionality and reliability.

The AGFB023R25A3I3E is equipped with a comprehensive suite of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly versatile for various communication needs. It is available in a 2581FBGA package, which is housed in a tray and has a moisture sensitivity level (MSL) of 3, ensuring a 168-hour protection period. This SoC is currently in an active product status, indicating its reliability and suitability for ongoing projects.

AGFB023R25A3I3E Features

• High-Speed Processing: The 1.4GHz clock speed ensures rapid data processing, making it ideal for applications requiring quick response times and high throughput.
• Flexible Architecture: The combination of MPU and FPGA architecture provides both high-level processing capabilities and the flexibility to customize logic and functions.
• Substantial Memory: With 256KB of RAM, the AGFB023R25A3I3E can handle complex data sets and multiple tasks simultaneously, enhancing overall system performance.
• Extensive I/O Connectivity: The 480 I/Os provide ample interfaces for connecting various peripherals and systems, making it highly adaptable to different application requirements.
• Rich Peripheral Set: Features like DMA and WDT enhance the SoC's functionality, providing efficient data management and system reliability.
• Versatile Connectivity Options: The inclusion of EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG ensures compatibility with a wide range of communication protocols and devices.
• Robust Packaging: The 2581FBGA package in a tray with an MSL of 3 ensures the SoC is protected and reliable for use in various environmental conditions.

AGFB023R25A3I3E Applications

The AGFB023R25A3I3E is well-suited for applications that demand high performance, flexibility, and extensive connectivity. Some specific use cases include:

• Embedded Systems: Ideal for embedded systems requiring real-time processing and high-speed data handling, such as industrial automation and control systems.
• Networking: Suitable for networking applications where fast data transfer and robust connectivity are crucial, such as routers and switches.
• Consumer Electronics: Perfect for consumer electronics that need to integrate multiple peripherals and communication protocols, like smart TVs and gaming consoles.
• Automotive: Can be used in automotive applications for advanced driver assistance systems (ADAS) and in-vehicle infotainment (IVI) systems, where reliability and performance are paramount.
• IoT Devices: Ideal for IoT devices that require low power consumption, high processing capabilities, and extensive connectivity options.

Conclusion of AGFB023R25A3I3E

The AGFB023R25A3I3E from Intel's Agilex F series is a versatile and powerful SoC that offers a unique blend of high-speed processing, flexible architecture, and extensive connectivity options. Its robust features and capabilities make it a standout choice for applications in embedded systems, networking, consumer electronics, automotive, and IoT devices. With its active product status and reliable packaging, the AGFB023R25A3I3E is poised to meet the demands of modern electronics, providing a reliable and high-performance solution for a variety of industries.