Intel_AGFB023R31C2I1VB
Intel_AGFB023R31C2I1VB
original

Intel
AGFB023R31C2I1VB

777-AGFB023R31C2I1VB
IC FPGA AGILEX-F 3184BGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFB023R31C2I1VB Description

AGFB023R31C2I1VB Description

The AGFB023R31C2I1VB is an advanced IC FPGA from Intel's Agilex F series, designed to deliver exceptional performance and flexibility for a wide range of embedded applications. This device features a 1.4GHz clock speed, ensuring rapid processing capabilities and efficient data handling. It is built on a robust architecture that combines a Microprocessor Unit (MPU) with Field-Programmable Gate Array (FPGA) technology, offering both high-performance processing and customizable logic capabilities.

The AGFB023R31C2I1VB is equipped with 256KB of RAM, providing ample memory for complex operations and data storage. It boasts 480 I/O pins, which significantly enhance its connectivity and interfacing options, making it suitable for intricate system designs. The device also includes essential peripherals such as Direct Memory Access (DMA) and Watchdog Timer (WDT), which further enhance its functionality and reliability.

This product is currently in an active status, indicating its availability and suitability for new projects. It is packaged in a 3184 BGA (Ball Grid Array) format, which is ideal for compact and high-density designs. The AGFB023R31C2I1VB supports a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly versatile for various communication protocols and interfaces.

AGFB023R31C2I1VB Features

  • High-Speed Processing: The 1.4GHz clock speed ensures rapid execution of complex tasks, making it ideal for high-performance applications.
  • Flexible Architecture: Combining MPU and FPGA technologies, this device offers both programmable logic and high-performance processing capabilities.
  • Robust Memory: With 256KB of RAM, the AGFB023R31C2I1VB can handle substantial data storage and processing tasks.
  • Extensive I/O Capabilities: The 480 I/O pins provide extensive interfacing options, allowing for complex and versatile system designs.
  • Advanced Peripherals: Integrated DMA and WDT peripherals enhance the device's functionality and reliability.
  • Versatile Connectivity: Supports multiple communication protocols, including Ethernet, I2C, SPI, UART/USART, and USB OTG, ensuring seamless integration with various systems.
  • Compact Packaging: The 3184 BGA package format is ideal for space-constrained applications, maintaining high performance in a small footprint.

AGFB023R31C2I1VB Applications

The AGFB023R31C2I1VB is well-suited for a variety of high-performance embedded applications, including but not limited to:

  • Industrial Automation: Ideal for controlling complex machinery and processes, where high-speed data processing and reliable interfacing are crucial.
  • Telecommunications: Suitable for base stations and communication hubs, where the device's extensive connectivity options and high-speed processing capabilities are beneficial.
  • Medical Devices: Can be used in advanced medical imaging and diagnostic equipment, where precise control and data handling are essential.
  • Automotive Systems: Applicable in advanced driver-assistance systems (ADAS) and infotainment systems, where the device's robust architecture and extensive I/O capabilities are advantageous.
  • Consumer Electronics: Ideal for high-end consumer devices that require high-speed processing and versatile connectivity, such as smart TVs and gaming consoles.

Conclusion of AGFB023R31C2I1VB

The AGFB023R31C2I1VB from Intel's Agilex F series is a versatile and high-performance IC FPGA that offers significant advantages over similar models. Its combination of MPU and FPGA technologies, extensive I/O capabilities, and robust memory make it an ideal choice for a wide range of embedded applications. The device's support for multiple communication protocols and its compact packaging further enhance its appeal for space-constrained and high-performance designs. Whether used in industrial automation, telecommunications, medical devices, automotive systems, or consumer electronics, the AGFB023R31C2I1VB delivers reliable performance and extensive functionality, making it a standout choice in the electronics industry.

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AGFB023R31C2I1VB is a System On Chip (SoC) from Intel. This product page provides its main specifications, pricing information, availability, and inquiry options.
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