Intel_AGFB027R25A2I2V
Intel_AGFB027R25A2I2V
original

Intel
AGFB027R25A2I2V

777-AGFB027R25A2I2V
IC FPGA AGILEX-F 2581FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
624
Peripherals
DMA, WDT
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AGFB027R25A2I2V Description

AGFB027R25A2I2V Description

The AGFB027R25A2I2V is a high-performance Embedded IC Chip from Intel's Agilex F series, designed to meet the demanding requirements of modern embedded systems. This IC features a 1.4GHz processing speed, combining a powerful MPU (Micro-Processing Unit) with an FPGA (Field-Programmable Gate Array) architecture. It offers a robust 256KB of RAM, ensuring efficient data handling and processing capabilities. With 624 I/O pins, this chip provides extensive connectivity options, making it versatile for a wide range of applications. The AGFB027R25A2I2V also includes essential peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer), enhancing its functionality and reliability.

AGFB027R25A2I2V Features

  • High-Speed Processing: The AGFB027R25A2I2V operates at a speed of 1.4GHz, ensuring rapid processing capabilities that are essential for real-time applications and complex computations.
  • Dual Architecture: The combination of MPU and FPGA architecture provides flexibility and scalability. The MPU handles high-level processing tasks, while the FPGA can be programmed to perform specific, custom functions, offering a balance between general-purpose processing and specialized tasks.
  • Robust Memory: With 256KB of RAM, this IC can efficiently manage data, making it suitable for applications requiring high-speed data processing and storage.
  • Extensive I/O Connectivity: The 624 I/O pins offer a wide range of connectivity options, allowing for seamless integration with various peripherals and systems.
  • Advanced Peripherals: The inclusion of DMA and WDT peripherals enhances the chip's functionality. DMA allows for efficient data transfer between memory and peripherals, while the WDT ensures system reliability by monitoring and resetting the system if it becomes unresponsive.
  • Active Product Status: As an active product, the AGFB027R25A2I2V is supported by Intel, ensuring ongoing updates, technical support, and availability.
  • Versatile Connectivity: The AGFB027R25A2I2V supports a variety of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it suitable for a wide range of embedded applications.
  • Packaging and Reliability: The chip is packaged in a tray format with a Moisture Sensitivity Level (MSL) of 3 (168 Hours), ensuring it is suitable for use in various environmental conditions.

AGFB027R25A2I2V Applications

The AGFB027R25A2I2V is ideal for a variety of applications due to its high performance and extensive connectivity options. Some specific use cases include:

  • Industrial Automation: The combination of high-speed processing and extensive I/O connectivity makes this IC suitable for controlling complex industrial processes and machinery.
  • Telecommunications: The AGFB027R25A2I2V's ability to handle high-speed data processing and its support for Ethernet and USB OTG make it ideal for applications in the telecommunications industry, such as network routers and switches.
  • Automotive Systems: The robustness and reliability of the AGFB027R25A2I2V, along with its extensive connectivity options, make it suitable for advanced driver-assistance systems (ADAS) and other automotive applications.
  • Consumer Electronics: The chip's versatility and performance make it suitable for high-end consumer electronics, such as smart TVs, gaming consoles, and advanced IoT devices.
  • Medical Devices: The AGFB027R25A2I2V's high-speed processing and reliability make it suitable for medical imaging devices, diagnostic equipment, and other critical medical applications.

Conclusion of AGFB027R25A2I2V

The AGFB027R25A2I2V is a versatile and high-performance Embedded IC Chip from Intel's Agilex F series, offering a unique combination of MPU and FPGA architecture. Its 1.4GHz processing speed, 256KB of RAM, and extensive I/O connectivity make it suitable for a wide range of applications, from industrial automation to consumer electronics. The inclusion of advanced peripherals such as DMA and WDT further enhances its functionality and reliability. With its active product status and extensive connectivity options, the AGFB027R25A2I2V is a reliable choice for modern embedded systems, providing a balance between performance, flexibility, and scalability.

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