Intel

AGFC019R25A3E3E

AGFC019R25A3E3E Description

The AGFC019R25A3E3E is an advanced Embedded IC Chip from Intel's Agilex F series, designed to deliver high performance and flexibility in a compact form factor. This IC FPGA features a 1.4GHz processing speed and operates within a temperature range of 0°C to 100°C (TJ), making it suitable for a wide range of industrial and embedded applications. The architecture combines a powerful MPU with an FPGA, providing a versatile platform for complex computing tasks. With 256KB of RAM and 480 I/O ports, the AGFC019R25A3E3E offers ample memory and connectivity options. Additional peripherals such as DMA and WDT enhance its functionality. The product is currently active and available in a tray package with a moisture sensitivity level (MSL) of 3 (168 hours).

AGFC019R25A3E3E Features

-High -Speed Processing: The 1.4GHz speed ensures rapid execution of complex algorithms and real-time processing tasks.

• Wide Operating Temperature Range: Suitable for use in environments ranging from 0°C to 100°C (TJ), making it ideal for industrial and rugged applications.
• Dual Architecture: Combines MPU and FPGA capabilities, offering both high-performance processing and programmable logic.
• Robust Memory and I/O: Equipped with 256KB of RAM and 480 I/O ports, providing ample resources for data-intensive applications.
• Advanced Peripherals: Features DMA and WDT, enhancing system reliability and efficiency.
• Comprehensive Connectivity: Supports EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, ensuring seamless integration with various peripherals.
• Reliable Packaging: Available in a tray package with an MSL of 3 (16 hours8), ensuring durability and reliability in storage and transportation.

AGFC019R25A3E3E Applications

The AGFC019R25A3E3E is ideal for applications requiring high performance and flexibility. Its combination of MPU and FPGA architecture makes it suitable for:

• Industrial Automation: Real-time control and monitoring systems.
• Embedded Systems: High-performance computing in compact devices.
• Telecommunications: Signal processing and network management.
• Automotive Electronics: Advanced driver assistance systems (ADAS) and infotainment systems.
• Medical Devices: Real-time data processing and monitoring in medical equipment.

Conclusion of AGFC019R25A3E3E

The AGFC019R25A3E3E from Intel's Agilex F series stands out as a versatile and high-performance Embedded IC Chip. Its unique combination of MPU and FPGA architecture, coupled with robust memory, I/O capabilities, and comprehensive connectivity options, makes it an ideal choice for a variety of demanding applications. The wide operating temperature range and reliable packaging further enhance its suitability for industrial and rugged environments. For engineers and designers seeking a powerful and flexible solution, the AGFC019R25A3E3E offers a compelling choice.