Intel_AGFC019R25A3I3E
Intel_AGFC019R25A3I3E
original

Intel
AGFC019R25A3I3E

777-AGFC019R25A3I3E
IC FPGA AGILEX-F 2581FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFC019R25A3I3E Description

AGFC019R25A3I3E Description

The AGFC019R25A3I3E is an advanced System on Chip (SoC) from Intel's Agilex F series, designed to deliver high performance and flexibility for a wide range of applications. This IC FPGA features a 1.4GHz processing speed, combining a powerful MPU and FPGA architecture to handle complex computational tasks efficiently. With 256KB of RAM and 480 I/O ports, the AGFC019R25A3I3E is well-suited for applications requiring high data throughput and extensive connectivity.

AGFC019R25A3I3E Features

  • High-Speed Processing: The 1.4GHz speed ensures rapid execution of tasks, making it ideal for real-time processing and high-frequency operations.
  • Dual Architecture: The MPU and FPGA architecture provides a balance between general-purpose processing and customizable hardware acceleration, offering flexibility and efficiency.
  • Robust Memory and I/O: With 256KB of RAM and 480 I/O ports, the AGFC019R25A3I3E can manage large datasets and support multiple peripheral devices simultaneously.
  • Comprehensive Connectivity: The AGFC019R25A3I3E supports a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it versatile for various applications.
  • Advanced Peripherals: Features like DMA and WDT enhance system performance and reliability, ensuring smooth operation and data integrity.
  • Packaging and Reliability: The Tray package and Moisture Sensitivity Level (MSL) of 3 (168 Hours) ensure the device is robust and suitable for industrial environments.

AGFC019R25A3I3E Applications

The AGFC019R25A3I3E is ideal for applications that require high performance, flexibility, and extensive connectivity. Some specific use cases include:

  • Industrial Automation: The combination of high-speed processing and robust I/O capabilities makes it suitable for controlling complex machinery and automated systems.
  • Telecommunications: The extensive connectivity options and high data throughput make it ideal for networking equipment and communication infrastructure.
  • Embedded Systems: The MPU and FPGA architecture allows for customizable solutions tailored to specific embedded applications, such as IoT devices and smart sensors.
  • Medical Devices: The reliability and extensive connectivity options make it suitable for medical equipment requiring precise control and data processing.

Conclusion of AGFC019R25A3I3E

The AGFC019R25A3I3E from Intel's Agilex F series is a versatile and high-performance SoC that offers a unique blend of processing power, flexibility, and connectivity. Its dual architecture, extensive I/O capabilities, and robust connectivity options make it a standout choice for a variety of applications, from industrial automation to telecommunications. The AGFC019R25A3I3E's advanced features and reliability ensure it remains a reliable and efficient solution for modern electronic systems.

FAQ

What operating temperature range does AGFC019R25A3I3E support?
AGFC019R25A3I3E has an operating temperature range of -40°C ~ 100°C (TJ).
Are there related or alternative parts for AGFC019R25A3I3E?
What is AGFC019R25A3I3E?
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