Intel_AGFC019R31C2E1V
Intel_AGFC019R31C2E1V
original

Intel
AGFC019R31C2E1V

777-AGFC019R31C2E1V
IC FPGA AGILEX-F 3184FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFC019R31C2E1V Description

AGFC019R31C2E1V Description

The AGFC019R31C2E1V is an advanced Embedded IC Chip from Intel's Agilex F series, designed to deliver high performance and flexibility in a compact form factor. This IC features a powerful 1.4GHz processing speed, making it suitable for demanding applications that require rapid data processing and execution. The operating temperature range of 0°C to 100°C (TJ) ensures reliable performance across a wide range of environmental conditions, making it ideal for industrial and embedded systems.

The architecture of the AGFC019R31C2E1V combines a Microprocessor Unit (MPU) with Field-Programmable Gate Array (FPGA) capabilities, offering a versatile platform for both general-purpose processing and custom logic implementation. With 256KB of RAM, the device can handle complex tasks and data-intensive operations efficiently. The extensive I/O capabilities, with 480 I/O pins, provide ample connectivity options for interfacing with various peripherals and systems.

AGFC019R31C2E1V Features

  • High-Speed Processing: The 1.4GHz speed ensures fast execution of tasks, making it suitable for real-time applications.
  • Wide Operating Temperature Range: The 0°C to 100°C (TJ) range ensures reliability in diverse environments.
  • Flexible Architecture: The MPU and FPGA architecture allows for both standard processing and custom logic design.
  • Substantial RAM: 256KB of RAM supports complex operations and data handling.
  • Extensive I/O Capabilities: 480 I/O pins provide robust connectivity options.
  • Peripheral Support: Integrated DMA and WDT enhance system functionality and reliability.
  • Connectivity Options: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG interfaces support a wide range of communication protocols.
  • Active Product Status: Ensures continued support and availability for ongoing projects.
  • Packaging: The Tray package format facilitates easy integration into various systems.

AGFC019R31C2E1V Applications

The AGFC019R31C2E1V is well-suited for a variety of applications due to its versatile architecture and robust features. Some ideal use cases include:

  • Industrial Automation: The combination of MPU and FPGA capabilities allows for efficient control and monitoring of complex industrial processes.
  • Embedded Systems: The compact form factor and extensive I/O options make it ideal for embedded systems requiring high performance and flexibility.
  • Communication Systems: The support for multiple communication protocols enables seamless integration into various communication networks.
  • Data Processing: The high-speed processing and substantial RAM make it suitable for data-intensive applications such as data acquisition and processing.
  • Consumer Electronics: The wide operating temperature range and robust connectivity options make it a reliable choice for consumer electronics.

Conclusion of AGFC019R31C2E1V

The AGFC019R31C2E1V from Intel's Agilex F series is a highly capable Embedded IC Chip that offers a blend of high performance, flexibility, and reliability. Its unique architecture, extensive I/O capabilities, and wide operating temperature range make it stand out from similar models. Ideal for applications ranging from industrial automation to consumer electronics, the AGFC019R31C2E1V provides a versatile solution for modern embedded systems. With its active product status and comprehensive feature set, it is a reliable choice for both current and future projects.

FAQ

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The standard lead time for AGFC019R31C2E1V is 12 Weeks.
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