Intel_AGFC023R24C2E3E
Intel_AGFC023R24C2E3E
original

Intel
AGFC023R24C2E3E

777-AGFC023R24C2E3E
IC FPGA AGILEX-F 2340BGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFC023R24C2E3E Description

AGFC023R24C2E3E Description

The AGFC023R24C2E3E is a high-performance Embedded IC Chip from Intel's Agilex F series, designed to meet the demanding requirements of modern embedded systems. This IC features a 1.4GHz processing speed, ensuring rapid execution of complex tasks. It operates within a temperature range of 0°C to 100°C (TJ), making it suitable for a wide range of environments, from industrial to automotive applications. The architecture combines a Microprocessor Unit (MPU) with Field-Programmable Gate Array (FPGA) capabilities, offering flexibility and programmability for diverse applications.

AGFC023R24C2E3E Features

  • High-Speed Processing: With a clock speed of 1.4GHz, the AGFC023R24C2E3E delivers exceptional performance, ideal for real-time processing and high-speed data handling.
  • Wide Operating Temperature Range: The operating temperature range of 0°C to 100°C (TJ) ensures reliability in extreme conditions, making it suitable for ruggedized applications.
  • Flexible Architecture: The combination of MPU and FPGA architecture provides a versatile platform for both general-purpose processing and custom hardware acceleration.
  • Robust Memory and I/O: Equipped with 256KB of RAM and 480 I/O pins, this IC can handle large datasets and complex interfacing requirements.
  • Comprehensive Peripherals: Features like DMA (Direct Memory Access) and WDT (Watchdog Timer) enhance system efficiency and reliability.
  • Active Product Status: As an active product, the AGFC023R24C2E3E benefits from ongoing support and updates from Intel.
  • Rich Connectivity Options: Supports EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration with various peripherals and communication protocols.
  • Packaging: Available in a Tray package, ensuring ease of handling and integration into PCB designs.

AGFC023R24C2E3E Applications

The AGFC023R24C2E3E is well-suited for a variety of applications due to its high performance, flexibility, and robust feature set. Some specific use cases include:

  • Industrial Automation: The combination of high-speed processing and wide temperature range makes it ideal for controlling complex machinery and systems in industrial environments.
  • Automotive Systems: Suitable for advanced driver-assistance systems (ADAS) and in-vehicle infotainment (IVI) systems, where reliability and performance are critical.
  • Telecommunications: Ideal for base stations and network equipment requiring high-speed data processing and reliable connectivity.
  • Medical Devices: Can be used in medical imaging and diagnostic equipment, where precision and real-time processing are essential.
  • Consumer Electronics: Enhances the performance of smart devices, gaming consoles, and other consumer electronics requiring advanced processing capabilities.

Conclusion of AGFC023R24C2E3E

The AGFC023R24C2E3E from Intel's Agilex F series is a powerful and versatile Embedded IC Chip designed to meet the needs of modern embedded systems. Its high-speed processing, wide operating temperature range, and flexible architecture make it a standout choice for a variety of applications. With robust memory, extensive I/O capabilities, and comprehensive connectivity options, the AGFC023R24C2E3E offers significant advantages over similar models. Whether used in industrial automation, automotive systems, telecommunications, medical devices, or consumer electronics, this IC delivers reliable performance and advanced functionality, making it an excellent choice for engineers and designers in the electronics industry.

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